Display Panel Overlapping Via Structure for Higher Aperture Ratio
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Solution Overview
Problem
Display panels with oxide semiconductor active layers face issues of poor lap between common and connecting electrodes due to undercut structures during dry etching, leading to poor display performance and reduced aperture ratio.
Innovation Solution
The design merges holes in the first and second conductive layers to reduce the occupied area, ensuring proper contact and increasing the aperture ratio by overlapping the orthographic projections of these holes on the substrate, thereby improving the transmission of common voltage signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If holes are staggered to avoid poor lap between electrodes, then reliability of electrode connection is improved, but aperture ratio deteriorates
Solution Approach 1:
The patent merges the first hole (for conductive layer contact) and the second hole (for electrode contact) into a single overlapping opening. This consolidation reduces the total area occupied by holes while maintaining both contact functions, thereby improving aperture ratio without compromising electrode connection reliability.
Solution Approach 2:
The patent utilizes vertical layering to resolve the contradiction. By stacking the first conductive layer, second conductive layer, and electrodes in different heights (dimensions), both holes can access the same vertical space through the overlapping opening, reducing planar area occupation while maintaining functional separation.
2Reliability
If inorganic film layers are stacked with active layer, then electron mobility and switching current ratio are improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the inorganic film layers into functionally distinct layers (first insulating layer with first hole, second insulating layer with second hole) positioned at different heights. This segmentation allows each layer to serve specific functions (conductive contact, electrode support, insulation) while maintaining overall structural organization and manageability.
Solution Approach 2:
The patent introduces vertical flexibility in the film layer structure by positioning holes at different heights rather than in a fixed planar arrangement. This dynamic spatial configuration allows optimization of both electrical connection paths and light transmission areas within the multi-layer structure.
Data Source
AI summary
The display panel provided in the present application includes the substrate and the first conductive layer, the first insulating layer, the second conductive layer, the second insulating layer, the common electrode, and the connecting electrode disposed on the substrate in layers. The first insulating layer is provided with a first hole, the first hole exposes the first conductive layer, and the second conductive layer contacts the first conductive layer through the first hole. The second insulating layer is provided with a second hole, and the second hole exposes the second conductive layer. An orthographic projection of the second hole on the substrate overlaps with an orthographic projection of the first hole on the substrate.