Display Panel Pad Structure for Ultra-Narrow Frame Connections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current display panels are not conducive to realizing an ultra narrow frame and stable electrical connections, which is essential for modern display devices with increasing demand for thinner designs.
Innovation Solution
The display panel design includes a pad region with gold fingers extending to the side edge, a flexible buffer layer covering the gold fingers, and a conductive part for electrical connection, allowing for an ultra narrow frame and enhanced protection and reliability of electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the TFT array substrate exceeds the CF substrate with a pad region containing gold fingers, then electrical connections can be established, but the frame width increases and ultra narrow frame design cannot be achieved
Solution Approach 1:
The gold fingers are arranged in the thickness direction (Z-axis) of the display panel, extending from the pad region on the display substrate through the sealed area to the opposing substrate. This vertical arrangement allows electrical connections to be made without increasing the horizontal frame width, enabling ultra narrow frame design while maintaining reliable electrical connections.
Solution Approach 2:
The gold fingers are nested within the sealed area formed by the frame sealant, with the opposing substrate's pad region positioned to receive the gold fingers. This nested configuration allows the electrical connection structure to be integrated within the existing panel boundaries without requiring additional horizontal space.
2Reliability
If gold fingers extend to the side edge of the display substrate, then electrical connections are enabled, but the gold fingers are vulnerable to damage during processing
Solution Approach 1:
A flexible buffer layer is provided that covers the gold fingers and extends beyond their boundaries. This buffer layer acts as a protective cushion during processing, absorbing mechanical stresses and preventing damage to the gold fingers before they are fully integrated into the final assembly.
Solution Approach 2:
The flexible buffer layer is made of a flexible material that can conform to the gold fingers' shape and provide protective coverage. This thin film structure protects the fragile gold fingers during handling and processing while maintaining the compact design needed for ultra narrow frame applications.
3Stability of the object's composition
If the pad region is sealed within the frame sealant area, then structural integrity is improved, but electrical connections become difficult to establish
Solution Approach 1:
The electrical connection structure is moved from a horizontal arrangement (pad region extending beyond the sealed area) to a vertical arrangement (gold fingers extending through the sealed area in the thickness direction). This allows the pad region to be fully sealed within the frame sealant area for structural integrity, while gold fingers provide electrical connections through the sealed region.
Solution Approach 2:
The display substrate is segmented into a sealed area (containing the active display region) and a non-sealed area (containing the pad region with gold fingers). The frame sealant seals the boundary between these areas, providing structural integrity while allowing gold fingers to extend through the sealed region to establish electrical connections.
Data Source
AI summary
A display panel includes an opposing substrate and a display substrate. At least one side of the display substrate has a pad area in which gold fingers are arranged. The orthographic projection of the opposing substrate on the display substrate covers the pad area. In a non-display area of the display panel, the opposing substrate and the display substrate are bonded by means of frame sealant. The pad area is located on the outer side of the frame sealant. Side surfaces of the gold fingers are exposed from the side surface of the display substrate. A conductive layer is formed on the side surfaces of the gold fingers. The display panel further includes a flexible buffer layer which is filled between the opposing substrate and the display substrate and covers the gold fingers. The flexible buffer layer is located on the outer side of the frame sealant.