Display Panel Side Encapsulation Film Against Water Vapor Intrusion

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Solution Overview

Problem

Mini LED display panels face corrosion and failure due to water vapor intrusion through the side junction between the encapsulation adhesive and the substrate, which is not effectively addressed by existing technologies.

Innovation Solution

A display panel design featuring an encapsulation film with a first encapsulation portion that covers the peripheral side of the panel body, extending from the substrate to the encapsulation layer, thereby sealing the side junction and preventing water vapor intrusion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an encapsulation adhesive is used to encapsulate LEDs and circuits on the substrate, then the basic encapsulation function is achieved, but water vapor can invade through the side junction between the encapsulation adhesive and the substrate, causing corrosion and failure

Engineering Contradiction:
Improveresistance to water vapor intrusionVSAvoidwater vapor intrusion through side junction
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from a planar encapsulation approach to a three-dimensional encapsulation structure. The encapsulation film is configured to wrap around the side surfaces of both the substrate and the encapsulation layer, creating a立体 (spatial) barrier that seals the side junction. This dimensional extension effectively blocks water vapor intrusion paths that were not addressable with conventional flat encapsulation adhesives.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a flexible encapsulation film that can conform to the contours of the substrate and encapsulation layer. This thin film structure is capable of wrapping around the side surfaces and adapting to the geometric configuration, providing a seamless barrier against water vapor while maintaining flexibility for the underlying components.

Inventive Principle:
Principle #30Flexible shells and thin films

2Reliability

If the encapsulation film covers the side junction area, then water vapor intrusion is prevented, but the manufacturing process becomes more complex

Engineering Contradiction:
Improveprotection against corrosionVSAvoidencapsulation film structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The encapsulation film is divided into distinct functional regions: a first encapsulation portion that covers the side surface of the substrate, and a second encapsulation portion that covers the side surface of the encapsulation layer. This segmentation allows each portion to be optimized for its specific protective function while simplifying the overall manufacturing process by treating different areas with appropriate encapsulation strategies.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20250072178A1Display panels and manufacturing methods thereof, and display apparatuses
Publication Date: 2025.02.27 GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
  • US20250072178A1 patent drawing
  • US20250072178A1 patent drawing

AI summary

The present disclosure discloses a display panel and a manufacturing method thereof, and a display apparatus. The display panel includes a panel body and an encapsulation film disposed on the panel body. The panel body includes a substrate, a light-emitting device layer, and an encapsulation layer. The light-emitting device layer is disposed on the substrate and includes a plurality of light-emitting elements disposed on the substrate. The encapsulation layer is disposed on the substrate and covers the light-emitting device layer. The encapsulation film includes a first encapsulation portion covering a peripheral side of the panel body, one end of the first encapsulation portion covers a side surface of the substrate, another end thereof extends along a first direction and covers a side surface of the encapsulation layer, and the first direction is a direction in which the substrate points to the encapsulation layer.