Single-Layer Display Panel Wiring to Prevent Interlayer Shorts
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Solution Overview
Problem
In current display panel technologies, the prone occurrence of short circuits between different metal layers, specifically between the driving chip input output signal wiring and the power supply wiring, leads to high costs and manufacturing issues.
Innovation Solution
The display panel design includes a grounding signal wiring, a power line, and a plurality of driving chips, where all these components are disposed in the same layer and do not intersect with each other, ensuring that the grounding signal wiring, the driving chip input output signal wiring, and the power line are parallel and spaced apart.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If driving chip input output signal wiring and power supply wiring are arranged in two or more layers, then wiring functionality is achieved, but short circuit is prone to appear between different metal layers
Solution Approach 1:
The patent merges multiple wiring functions (grounding signal wiring, driving chip input output signal wiring, and power line) into a single layer, eliminating the need for multiple layers. This consolidation prevents short circuits between layers while maintaining all necessary wiring functionalities through careful spatial arrangement and spacing.
2Ease of manufacture
If multiple layers of metal wirings are used, then signal and power transmission is achieved, but manufacturing cost increases
Solution Approach 1:
The patent reduces manufacturing complexity and cost by consolidating all wiring into a single layer. This eliminates the complex multi-layer stacking process, reduces material usage, and simplifies manufacturing steps while still achieving complete signal and power transmission functionality.
Data Source
AI summary
A display panel is provided, including a grounding signal wiring, driving chips, a driving chip input output signal wiring, and a power line. A grounding signal pin is connected to the grounding signal wiring. The driving chip input output signal wiring is configured to connect a stage-transfer signal input pin and a stage-transfer signal output pin of two adjacent driving chips. The grounding signal wiring, the driving chip input output signal wiring, and the power line are disposed in a same layer and do not intersect with each other.