Display Panel Assembly Manufacturing via Mother Substrate Division
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Solution Overview
Problem
Conventional methods for manufacturing display panel assemblies with high interconnection density require separate substrates and additional processes, leading to increased costs and manufacturing time, and are limited by the use of thick film processes for connection lines which do not allow for narrow enough line widths for high integration.
Innovation Solution
A method involving a mother substrate with defined regions for forming pixel driving lines, pixels, and circuit connection lines in a single process, followed by division into thin film transistor and driving circuit boards, connected via flexible circuit boards, using photolithography for precise line formation and integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate substrates are used for pixel driving lines and circuit connection lines, then manufacturing flexibility is improved, but manufacturing cost and time increase
Solution Approach 1:
The patent merges the formation of pixel driving lines and circuit connection lines into a single photolithography process on the same substrate. This combining of previously separate manufacturing steps into one unified process reduces manufacturing time and cost while maintaining the ability to produce both line types with appropriate precision
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as both the base for pixel driving lines and the base for circuit connection lines. This multi-functional use of a single substrate eliminates the need for separate substrates and their associated handling, alignment, and bonding processes
2Ease of manufacture
If thick film process is used for connection lines, then manufacturing simplicity is improved, but line width precision deteriorates
Solution Approach 1:
The patent changes the manufacturing parameter from thick film process to photolithography process. This parameter change enables precise control of line width through photomask design and exposure parameters, achieving the narrow line widths required for high interconnection density while maintaining manufacturing efficiency through a single-process approach
3Productivity
If narrow line widths are achieved for high interconnection density, then interconnection density is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent replaces mechanical thick film deposition methods with photolithography, which uses optical patterns to define line widths. This substitution enables precise control of narrow line widths through optical exposure parameters and photomask design, achieving high interconnection density with consistent precision across the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and time by integrating multiple components on a single substrate with high precision, enabling narrower line widths and higher interconnection density without the need for separate substrates or additional processes.
Implementation Method 1
forming a plurality of pixel driving lines and a plurality of pixels which is connected to the pixel driving lines on each of the first regions of the mother substrate in a same process at the same time as forming a plurality of circuit connection lines on each of the dummy regions of the mother substrate
Data Source
AI summary
A method of manufacturing a display panel assembly includes: preparing a mother substrate on which are defined first regions and dummy regions respectively between adjacent first regions; forming pixel driving lines and pixels connected to the pixel driving lines on each of the first regions in a same process at the same time as forming circuit connection lines on each of the dummy regions; connecting a driving element which drives the pixels to the circuit connection lines of the dummy regions; dividing the mother substrate to separate the first regions and the dummy regions from each other, each of the separated first regions defining a thin film transistor board of the display panel assembly, and each of the separated dummy regions defining a driving circuit board of the display panel assembly; and connecting the driving circuit board to the thin film transistor board.