Display Panel Substrate Groove Direct Bonding
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Solution Overview
Problem
The existing methods for connecting a common electrode or touch control pad on a first substrate with a TFT array circuit on a second substrate in display panels are complex and costly, requiring multiple Flexible Printed Circuit Boards (FPCs) to be bonded twice.
Innovation Solution
A display panel design featuring a first substrate with a concave groove and a convex section on its periphery, where an electrode layer with conductive sections extends outward from the groove, allowing direct electrical connection with corresponding conductive sections on a second substrate, simplifying the bonding process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple FPCs are used to connect the common electrode or touch control pad on the first substrate with the TFT array circuit on the second substrate, then electrical connection is achieved, but the process flow becomes complicated and costly due to multiple bonding processes
Solution Approach 1:
The patent merges multiple FPC bonding operations into a single bonding process by integrating the common electrode or touch control pad directly onto the first substrate, eliminating the need for separate FPC intermediaries and reducing the number of bonding steps from two to one
Solution Approach 2:
The patent extracts and eliminates the FPC intermediate component from the connection system, allowing direct bonding between the first substrate (containing common electrode or touch control pad) and the second substrate (TFT array circuit), thereby simplifying the overall structure and process
2Reliability
If multiple FPCs are bonded twice to achieve electrical connection between substrates, then conduction is established, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple bonding operations into a single bonding step by directly bonding the first substrate to the second substrate, eliminating the need for repeated FPC bonding and thereby reducing manufacturing costs
Solution Approach 2:
The patent eliminates the use of expensive FPC intermediaries by implementing a direct substrate bonding approach, using the substrates themselves as the permanent connection medium rather than disposable or temporary FPC components
3Device complexity
If a concave groove with electrode layer extending to convex section is used on the first substrate, then direct electrical connection with the second substrate is achieved, but the substrate structure becomes more complex
Solution Approach 1:
The patent segments the substrate surface into distinct functional regions: a concave groove area for housing the electrode layer and a convex section for providing the bonding surface, allowing each region to perform its specific function optimally
Solution Approach 2:
The patent introduces vertical dimensionality to the substrate structure by creating a concave groove and convex section profile, transforming a flat 2D substrate surface into a 3D structured surface that enables direct electrical connection while maintaining bonding integrity
Data Source
AI summary
The invention discloses a display panel, a method of manufacturing the same and a display device so as to simplify a process of transmitting an electrical signal between a first substrate and a second substrate of the display panel at a lower cost. The display panel includes a first substrate and a second substrate disposed opposite to each other. The first substrate has a concave groove surrounded by a convex section and facing the second substrate. The display panel also includes an electrode layer on the surface of the groove and having at least one first conductive section extending outward from inside of the concave groove to the top end face of the convex section; and at least one second conductive section on the second substrate and electrically connected with the respective first conductive section.