Display Panel Through Holes Heat Conduction
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Solution Overview
Problem
High heat generation in display panels due to light-emitting elements affects their performance, particularly in high PPI displays, where efficient heat dissipation is a major obstacle.
Innovation Solution
A display panel structure is designed with a thin film transistor array layer and a light-emitting function layer, featuring specific through holes and electrode configurations that facilitate heat conduction away from the light-emitting elements, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If more light-emitting elements are located on the display panel to increase PPI, then the display resolution is improved, but the heat generation increases and affects display panel performance
Solution Approach 1:
The display panel is divided into functionally independent layers (thin film transistor array layer and light-emitting function layer) with distinct heat dissipation paths. The through holes create segmented thermal conduction channels that separate heat flow from different light-emitting elements, allowing independent heat management for each pixel region while maintaining high display resolution
Solution Approach 2:
The through holes filled with conductive material act as thermal intermediaries between the light-emitting elements and the substrate. These intermediary structures facilitate efficient heat transfer from the light-emitting function layer through the insulating layers to the substrate, solving the heat accumulation problem in high PPI displays
2Ease of manufacture
If traditional layered structure is used without through holes, then the manufacturing process is simple, but heat dissipation efficiency is poor
Solution Approach 1:
The invention transitions from a traditional planar layered structure to a three-dimensional structure with vertical through holes penetrating multiple layers. This dimensional change creates direct thermal conduction pathways from the light-emitting function layer through the insulating layers to the substrate, dramatically improving heat dissipation efficiency while maintaining manufacturing feasibility through standard semiconductor fabrication processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved heat dissipation structure effectively reduces the temperature of the light-emitting function layer, enhancing the display panel's performance and efficiency by conducting heat away from the light-emitting elements.
Implementation Method 1
A display panel structure is designed with a thin film transistor array layer and a light-emitting function layer, featuring specific through holes and electrode configurations that facilitate heat conduction away from the light-emitting elements, enhancing heat dissipation efficiency
Data Source
AI summary
A display panel, a method for manufacturing the display panel, and a display device including the display panel are provided. The display panel includes: a thin film transistor array layer, and a light-emitting function layer at a side of the thin film transistor array layer. The thin film transistor array layer includes a planarization layer, an electrode layer, a first insulation layer, an active layer and a buffer layer. The electrode layer includes at least one first electrode and second electrode, and each first electrode includes a connection portion and an electrode portion which are connected to each other. The light-emitting function layer includes first contact electrodes and light-emitting elements. Heat generated by the light-emitting function layer is conducted to electrode portion of the first electrode through the connection portion of the first electrode and is uniformly distributed on the connection portion and the electrode portion.