Display Panel Bonding Structure for Thin Narrow-Bezel Touch Integration
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Solution Overview
Problem
Touch-control display screens in existing technologies face challenges in achieving a combination of small thickness, simple process, narrow frame, and full screen due to the integration of external touch-control modules, which increase thickness and process complexity.
Innovation Solution
Integration of a touch-control chip and a display driving chip into one chip assembly, with the touch-control layer overlapping the display screen body and encapsulation area, utilizing a bonding structure within a through hole in the encapsulation layer to reduce frame width and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an external touch-control module is adopted, then touch-control functionality is achieved, but the thickness and process difficulty of the display screen increase
Solution Approach 1:
The patent combines the touch-control chip and display driving chip into a single integrated chip assembly, merging two separate functional modules into one unified component. This integration eliminates the need for external touch-control modules while reducing overall device complexity and simplifying the manufacturing process.
Solution Approach 2:
The integrated chip assembly serves multiple functions simultaneously - it acts as both the touch-control chip and the display driving chip. This multi-functional design allows a single component to replace what would traditionally require separate external modules, thereby achieving touch-control functionality without increasing process difficulty.
2Adaptability or versatility
If an external touch-control module is adopted, then touch-control functionality is achieved, but the thickness of the display screen increases
Solution Approach 1:
The touch-control chip and display driving chip are merged into a single integrated chip assembly that is directly mounted on the display panel. This consolidation eliminates the need for separate external modules and reduces the overall thickness of the display screen while maintaining full touch-control functionality.
Solution Approach 2:
The patent repositions the touch-control layer to overlap with the display screen body and encapsulation area in the vertical dimension. By utilizing the Z-axis space more efficiently and integrating components in the thickness direction rather than adding lateral extensions, the design achieves touch-control functionality without increasing screen thickness.
3Length of stationary object
If the touch-control layer is positioned to overlap with the display screen body and encapsulation area, then frame width is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The bonding structure is pre-formed within the encapsulation layer before final assembly. This preliminary preparation of the bonding structure ensures precise alignment between the touch-control layer and display screen body during subsequent assembly steps, reducing the actual manufacturing precision requirements during the critical alignment phase.
Solution Approach 2:
The bonding structure acts as an intermediary element between the touch-control layer and the display component layer. This intermediate bonding structure facilitates precise positioning and alignment, enabling the touch-control layer to overlap with the display screen body and encapsulation area while maintaining manufacturable alignment tolerances.
4Device complexity
If chips are integrated into one assembly, then thickness and process difficulty are reduced, but frame width becomes wide
Solution Approach 1:
The patent utilizes the vertical dimension (Z-axis) by positioning the touch-control layer to overlap with the display screen body and encapsulation area. This three-dimensional arrangement allows the integrated chip assembly to achieve narrow frame width by extending into the thickness direction rather than requiring lateral space, thus resolving the contradiction between integration benefits and frame width.
Data Source
AI summary
A display panel includes: a substrate; a display component layer disposed on a side of the substrate; an encapsulation layer disposed on a side of the display component layer away from the substrate; and a touch-control layer disposed on a side of the encapsulation layer away from the display component layer. The display component layer and the touch-control layer are bonded by a bonding structure. A through hole is disposed in the encapsulation layer, and the bonding structure is disposed in the through hole. According to the display panel provided in the embodiments of the present application, a touch-control chip and a display driving chip are integrated into one chip assembly, and a position of the touch-control layer contacted with a display screen body and an encapsulation area of the display screen body are overlapped.