Display Device Passivation Grooves Prevent Metal Overflow Shorts
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Solution Overview
Problem
The challenge in display devices, particularly in head-mounted displays, is the occurrence of shorts between light-emitting elements, leading to defects due to metal material overflow during bonding with semiconductor circuit boards.
Innovation Solution
Incorporating grooves and partition walls in the passivation layer of the display device to prevent metal overflow between light-emitting elements, ensuring that the grooves do not overlap with the light-emitting elements and are designed to accommodate the semiconductor layers, thereby preventing shorts and defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If grooves are added to the passivation layer to prevent metal overflow, then reliability is improved, but device complexity increases
Solution Approach 1:
The passivation layer is segmented by introducing grooves that divide it into multiple regions. These grooves create physical barriers that segment the metal material flow paths during bonding, preventing metal overflow between adjacent light-emitting elements while maintaining the overall integrity of the passivation layer.
Solution Approach 2:
The grooves act as intermediary structures between adjacent light-emitting elements. They serve as buffer zones that intercept and contain metal material during the bonding process, preventing direct contact and short circuits between neighboring elements without requiring direct modification of the elements themselves.
2Manufacturing precision
If grooves are positioned between light-emitting elements to prevent shorts, then manufacturing precision is improved, but the groove design becomes more complex
Solution Approach 1:
The passivation layer is designed with local quality variations through strategically placed grooves. The grooves are positioned specifically in regions where metal overflow is most likely to occur during bonding, creating localized barriers precisely where needed rather than uniformly across the entire structure. This allows for precise control of metal flow without unnecessary complexity in low-risk areas.
Solution Approach 2:
The grooves are pre-formed in the passivation layer before the bonding process occurs. This preliminary structuring of the passivation layer with grooves in advance prepares the device to naturally contain metal material during subsequent bonding operations, preventing overflow before it can cause shorts between adjacent light-emitting elements.
Data Source
AI summary
A display device including: a substrate including pixel electrodes; a passivation layer on the substrate, a groove in the passivation layer between the pixel electrodes;contact electrodes on the pixel electrodes; and a light-emitting element layer comprising a plurality of light-emitting elements respectively bonded onto the contact electrodes and having a plurality of semiconductor layers thereon. The groove does not overlap the plurality of light-emitting elements.