Display Substrate Pin Layout With Insulating Barriers Against Corrosion

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Solution Overview

Problem

Connecting pins in display substrates are prone to corrosion due to water molecules and conductive ions diffusing into the display panel, leading to electrical short circuits or connection failures, which can cause partial or complete functional damage.

Innovation Solution

The display substrate design includes first and second connecting pins in different conductive layers with an insulating structure in between, and may incorporate grooves, floating pins, and barrier structures to delay the diffusion of water molecules and conductive ions, thereby extending the life of the display substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If connecting pins are arranged in the bonding area for signal transmission, then electrical connection function is achieved, but connecting pins are prone to corrosion from water molecules and conductive ions

Engineering Contradiction:
Improveconnection reliabilityVSAvoidcorrosion from water molecules and conductive ions
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent places connecting pins in different conductive layers (different spatial dimensions) to reduce their horizontal proximity. By stacking pins vertically across multiple layers with insulating structures between them, the diffusion path for water molecules and conductive ions is lengthened, reducing corrosion risk while maintaining electrical connection functionality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Insulating structures are introduced as intermediary elements between connecting pins in adjacent conductive layers. These insulating structures act as barrier layers that hinder the diffusion of water molecules and conductive ions, thereby protecting the connecting pins from corrosion while allowing electrical signals to pass through the pins themselves.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Area of stationary object

If multiple connecting pins are placed in the same conductive layer for compact layout, then device area is reduced, but distance between pins is shortened increasing corrosion risk

Engineering Contradiction:
Improvebonding areaVSAvoiddiffusion of water molecules and conductive ions
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from a two-dimensional arrangement of pins in the same layer to a three-dimensional arrangement across multiple conductive layers. This vertical stacking allows pins to be positioned closer in plan view while maintaining adequate protection distance through the insulating structures separating different layers, thus reducing corrosion risk without increasing area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent segments the conductive structures into multiple separate conductive layers with insulating structures between them. This segmentation creates multiple barrier zones that water molecules and conductive ions must traverse, effectively increasing the protection distance while maintaining compact overall dimensions.

Inventive Principle:
Principle #1Segmentation

3Reliability

If insulating structures are added between connecting pins in different layers, then corrosion protection is improved, but device complexity increases

Engineering Contradiction:
Improvecorrosion resistanceVSAvoidmulti-layer structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The insulating structures serve multiple functions simultaneously: they provide electrical insulation between different conductive layers, act as barrier layers against water molecule and conductive ion diffusion, and maintain the structural integrity of the multi-layer configuration. This multi-functionality reduces the need for additional separate protective components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the insulation function and corrosion protection function into a single integrated insulating structure. Rather than adding separate protective layers, the insulating structures between conductive layers perform both electrical isolation and chemical protection, thereby limiting complexity increase while achieving dual benefits.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively delays the corrosion of connecting pins by lengthening the diffusion path of water molecules and conductive ions, enhancing the durability and longevity of the display substrate.

Implementation Method 1

water molecules and conductive ions have the opportunity to penetrate into the interior of the display panel. Over time and under the influence of temperature, humidity, and electric fields, the water molecules and conductive ions will diffuse in the display panel

Methodology Applied
Scientific EffectDiffusion: Diffusion

Data Source

PatentUS20250309144A1Display substrate, touch display panel, and touch display device
Publication Date: 2025.10.02 WUHAN TIANMA MICROELECTRONICS CO LTD SHANGHAI BRANCH
  • US20250309144A1 patent drawing
  • US20250309144A1 patent drawing
  • US20250309144A1 patent drawing

AI summary

A display substrate, a touch display panel and a touch display device are provided. The display substrate includes: a base substrate including a bonding area; and first connecting pins and second connecting pins in the bonding area. Along a direction from the first connecting pins to the second connecting pins, an insulating structure is provided between the first connecting pins and the second connecting pins. One first connecting pin and one second connecting pin adjacent to each other are disposed in different conductive layers.