Display Power Supply Line Multilayer Structure for Short Circuit Prevention

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Solution Overview

Problem

In display apparatuses, a short circuit can occur between vertically stacked wires due to the reduction in insulating layer thickness during the patterning process of conductive layers, leading to reliability issues.

Innovation Solution

The display apparatus incorporates a multilayer structure for the power supply line with a first conductive layer and a second conductive layer, where the second conductive layer clad's the first conductive layer, and the insulating layer has step surfaces to maintain thickness and prevent short circuits, along with a sealing portion that attaches the substrates and contacts the insulating layer directly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the insulating layer thickness is reduced during the patterning process of conductive layers, then the manufacturing complexity is reduced, but the reliability deteriorates due to short circuits between vertically stacked wires

Engineering Contradiction:
Improveinsulating layer thicknessVSAvoidshort circuit prevention
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent introduces a vertical multilayer structure with first and second conductive layers stacked at different heights, separated by an insulating layer. This dimensional arrangement allows wires to cross without shorting, as the insulating layer maintains vertical separation while enabling horizontal connectivity in multiple layers. The fan-out portion extends wires horizontally at different elevations to avoid vertical intersections.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The insulating layer acts as an intermediary substance between the first and second conductive layers, preventing direct electrical contact while allowing both layers to function. This mediator maintains the necessary electrical isolation even as the overall structure becomes more integrated and compact, solving the contradiction between reduced thickness and maintained reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a multilayer conductive structure is implemented to prevent short circuits, then the reliability is improved, but the device complexity increases

Engineering Contradiction:
Improveshort circuit preventionVSAvoidconductive layer structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The conductive structure is segmented into distinct first and second conductive layers, each serving specific routing functions. This segmentation allows independent optimization of each layer's path and thickness, preventing short circuits while managing complexity through modular design. The fan-out portion is also segmented into multiple segments extending in different directions at different heights.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The first conductive layer is nested within a structure that includes the second conductive layer at a different vertical level. The insulating layer envelops the first conductive layer, creating a nested configuration where simpler structures are contained within more complex ones, allowing reliable short circuit prevention while organizing complexity hierarchically.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Length of stationary object

If the insulating layer is made thinner to reduce overall device thickness, then the device thickness is reduced, but the manufacturing precision requirements increase to prevent etching through the insulating layer

Engineering Contradiction:
Improvedevice thicknessVSAvoidetching control
Core Design Contradiction:
Length of stationary objectVSManufacturing precision

Solution Approach 1:

The insulating layer is applied with varying local qualities - thicker regions are provided where etching processes are most aggressive or where short circuit risks are highest, while thinner regions are used where space is constrained and etching risks are lower. This localized thickness variation allows overall device thinning while maintaining manufacturing feasibility and reliability in critical areas.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11404521B2Display apparatus including power supply line and fan-out portion
Publication Date: 2022.08.02 SAMSUNG DISPLAY CO LTD
  • US11404521B2 patent drawing
  • US11404521B2 patent drawing
  • US11404521B2 patent drawing

AI summary

A display apparatus includes a first substrate including a display area and a peripheral area on a side of the display area, a second substrate facing the first substrate, a fan-out portion arranged in the peripheral area and including a plurality of wires, a power supply line arranged over the fan-out portion and in the peripheral area, an insulating layer arranged between the plurality of wires and the power supply line, and a sealing portion arranged in the peripheral area. The sealing portion surrounds a periphery of the display area and attaches the first substrate and the second substrate to each other. The peripheral area includes an overlapping area in which the fan-out portion, the power supply line, and the sealing portion overlap one another. The power supply line arranged in the overlapping area includes a first conductive layer and a second conductive layer arranged on the first conductive layer.