Display Device Protection Layer Segmentation
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Solution Overview
Problem
Existing LED display devices lack effective protection for their light-emitting components, leading to reliability issues and inefficient production processes.
Innovation Solution
A display device design featuring a protection layer with an organic sub-layer and an inorganic sub-layer surrounding the light-emitting component, which includes a conductive adhesion film with specific particle dimensions and materials to enhance bonding and mechanical properties, and a method for forming this structure using eutectic bonding and curing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protection layer is added around the light-emitting component, then reliability is improved, but device complexity increases
Solution Approach 1:
The protection layer is divided into two distinct sub-layers: an organic sub-layer and an inorganic sub-layer. Each sub-layer provides specific protective functions, with the organic sub-layer offering flexibility and adhesion while the inorganic sub-layer provides barrier properties against moisture and oxygen. This segmentation allows the system to achieve comprehensive protection without requiring a single complex protective structure.
Solution Approach 2:
The protection layer employs a composite structure combining organic and inorganic materials. The organic sub-layer (e.g., polyimide or acrylic resin) provides mechanical flexibility and good adhesion to the light-emitting component, while the inorganic sub-layer (e.g., silicon oxide or silicon nitride) offers superior moisture and oxygen barrier properties. This composite approach achieves enhanced reliability by leveraging the complementary strengths of different material classes.
2Strength
If a composite protection layer with organic and inorganic sub-layers is used, then mechanical properties are improved, but manufacturing complexity increases
Solution Approach 1:
The protective structure is segmented into an organic sub-layer and an inorganic sub-layer, with the inorganic sub-layer surrounding the organic sub-layer. This segmentation allows each material to be optimized for its specific function while maintaining a relatively simple manufacturing process through sequential deposition.
Solution Approach 2:
The composite protection layer combines organic materials (providing flexibility and adhesion) with inorganic materials (providing hardness and barrier properties). The inorganic sub-layer is formed to surround the organic sub-layer, creating a protective structure that leverages the complementary mechanical properties of both material types without requiring complex manufacturing steps.
3Ease of manufacture
If the connection feature is left exposed, then ease of bonding is improved, but reliability deteriorates
Solution Approach 1:
The protection layer is designed with local quality by leaving the lower portion of the connection feature exposed while surrounding other portions with the organic and inorganic sub-layers. This selective protection approach maintains ease of bonding at the exposed connection feature interface while providing reliability protection to the light-emitting component body through the layered structure.
Solution Approach 2:
Instead of completely enclosing the connection feature, the protection layer applies partial protection by surrounding only the necessary portions of the light-emitting component. This partial action approach balances bonding ease (through exposed connection features) with reliability (through protected component body), avoiding the excessive action of full enclosure that would complicate the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved reliability and mechanical properties of the display device by effectively protecting the light-emitting components and enabling cost-effective, convenient production.
Implementation Method 1
bonded to each other by an adhesion film, the adhesion film comprising a plurality of conductive particles
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 1E~1F
AI summary
A display device is provided. The display device includes a thin-film transistor substrate, a conductive pad disposed on the thin-film transistor substrate, and an adhesion film disposed on the conductive pad. The adhesion film includes a plurality of conductive particles. The display device also includes a light-emitting component disposed on the adhesion film. The light-emitting component includes a connection feature. The display device also includes a protection layer partially surrounding the light-emitting component. The connection feature of the light-emitting component has a lower portion not surrounded by the protection layer. The adhesion film has a thickness of T, one of the plurality of conductive particles has a diameter of d, the lower portion of the connection feature has a thickness of t, and 0<t≦T-d.