Display Panel Side-Connection Substrate for Large-Glass Circuit Bonding
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Solution Overview
Problem
As display substrate sizes increase, arranging wires on the side of the glass substrate to form circuits becomes increasingly difficult, making it challenging to connect display circuits effectively.
Innovation Solution
A method involving a display substrate with an array circuit layer, a connecting substrate with a binding circuit layer and a connecting circuit layer, and a control unit, where the connecting substrate is fixed to the display substrate, and the circuit layers are electrically connected to facilitate circuit formation and connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wires are arranged on the side of the glass substrate to form circuits, then display circuits can be connected to the side or rear of the glass substrate, but as the display substrate size increases, the circuit preparation becomes increasingly difficult
Solution Approach 1:
The invention divides the circuit system into multiple independent substrates: a display substrate for displaying images and a separate connecting substrate for forming circuits. This segmentation allows the circuit preparation to be performed on a dedicated substrate rather than on the side of a large display substrate, thereby maintaining ease of manufacture while preserving connection capability. The connecting substrate can be independently processed and then connected to the display substrate through binding circuits.
2Ease of operation
If wires are arranged on the side of the glass substrate, then circuits can be formed for connection, but the process becomes impractical for large-sized substrates
Solution Approach 1:
The invention transitions from a two-dimensional arrangement where circuits are formed on the side surface of the display substrate to a three-dimensional configuration using a separate connecting substrate. This allows circuits to be formed on a dedicated substrate in a separate processing plane, making the operation easier while managing structural complexity through modular design. The connecting substrate acts as an intermediary that bridges the display substrate and external circuits without requiring complex side-surface wiring on large substrates.
Data Source
AI summary
A method of manufacturing a display panel includes following operations. A display substrate is provided. The display substrate includes a first surface, a second surface opposite to the first surface, and a side surface connected to the first surface and the second surface. An array circuit layer is arranged on the first surface of the display substrate. A connecting substrate is provided. A binding circuit layer and a connecting circuit layer connected to the binding circuit layer are formed on a surface of the connecting substrate. The connecting substrate having the binding circuit layer and the connecting circuit layer is fixed to a side of the display substrate. The connecting circuit layer may be electrically connected to the array circuit layer, and the array circuit layer is electrically connected to the binding circuit layer through the connecting circuit layer. A control unit is bound on the binding circuit layer.