Display Device Slit Etch Stop Layer Residue Control
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Solution Overview
Problem
The steeply tapered side face in the bending area of display devices can cause residue and leaks between lead wiring lines, leading to connectivity issues.
Innovation Solution
A display device with a slit formed in inorganic film layers, featuring a first slit with etch stop layers at its ends and a second slit with a greater width, reducing residue and leaks between lead wiring lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a bending area with a steeply tapered side face is formed to fold the display device, then the display device can be bent, but residue is likely to remain between lead wiring lines causing leaks
Solution Approach 1:
The inorganic film layers are segmented into multiple layers (first inorganic film layer and second inorganic film layer), with each layer having a slit formed at different positions. This segmentation allows the etch stop layer to be strategically placed at the first slit position, creating a stepwise structure that prevents residue accumulation while maintaining bending capability
Solution Approach 2:
An etch stop layer is introduced as an intermediary element between the two inorganic film layers at the first slit position. This etch stop layer acts as a mediator that creates a stepwise side face structure, preventing the etching process from creating residue between lead wiring lines while allowing the bending area to function properly
2Quantity of substance
If lead wiring lines are patterned to intersect with the bending area, then electrical connections are established, but residue formation causes leaks between the lead wiring lines
Solution Approach 1:
The etch stop layer is preliminarily formed at the first slit position before the lead wiring lines are patterned. This preliminary action creates a stepwise side face structure in advance that guides the etching process, ensuring that when lead wiring lines are later patterned to intersect the bending area, residue does not accumulate between them
Solution Approach 2:
The structure transitions from a uniform single-slit design to a localized dual-slit configuration with different widths. The first slit (narrower) is positioned where the etch stop layer is formed, while the second slit (wider) is positioned elsewhere, creating local quality variations that prevent residue formation specifically at the critical lead wiring line intersection areas
Data Source
AI summary
A slit has ends each close to one of a display area and a terminal. The ends are each formed of a stepwise side face, including etch stop films.