Display Substrate 3D Wiring Layout for Narrow-Bezel Panels
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Solution Overview
Problem
Current display devices face challenges in narrowing the frame width due to the large area occupied by wiring and bending regions, which limits further reduction in screen ratio.
Innovation Solution
A display substrate design featuring a first insulation structure with grooves, a first wiring layer covering the groove sides and bottom, and a second insulation structure with through-holes, allowing for fanout wiring and connection to external components without a bending area, thereby reducing the wiring district and achieving a narrower frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If wiring area and bending area are used to connect display area to external components, then connection function is achieved, but frame width increases and screen occupation ratio decreases
Solution Approach 1:
The patent transitions wiring from a 2D planar layout to a 3D vertical structure by forming grooves in the insulation layer and placing wiring layers on both the side walls and bottom surfaces of these grooves. This three-dimensional wiring arrangement allows signals to be routed vertically through the substrate thickness, eliminating the need for large horizontal wiring areas and bending regions, thereby reducing frame width while maintaining connection functionality.
Solution Approach 2:
The patent implements nested wiring structures where multiple wiring layers are arranged at different depths within grooves of the insulation layer. The first wiring layer is positioned on the side wall and bottom of the groove, while the second wiring layer is positioned on the first wiring layer, creating a nested configuration. This allows multiple signal paths to be compacted vertically within the same horizontal footprint, reducing the overall wiring area required.
2Length of stationary object
If bending region is used to achieve narrow frame design, then frame width is reduced, but wiring complexity and manufacturing difficulty increase
Solution Approach 1:
The patent segments the wiring path into distinct vertical and horizontal components. The grooves provide vertical wiring channels that directly connect the display area to the rear side, eliminating the need for complex bending regions. The wiring is divided into discrete layers (first wiring layer on groove side wall, second wiring layer on first wiring layer) that can be independently formed and controlled, simplifying the overall structure while achieving narrow frame dimensions.
Solution Approach 2:
The patent performs preliminary actions by pre-forming grooves in the insulation layer before depositing the wiring layers. These grooves are created with specific depths and positions to predetermined locations, establishing the three-dimensional wiring pathways in advance. This preliminary groove formation simplifies subsequent wiring deposition and eliminates the need for complex post-processing bending operations, reducing manufacturing complexity while achieving the narrow frame design.
Data Source
AI summary
A display substrate, a display device, a method of forming a display substrate, and a method of forming a display device are provided. The display substrate includes: a first insulation structure, including a display area and a frame area, where the frame area is arranged around the display area, and at least one first groove is arranged in the first insulation structure of the display area; a first wiring layer arranged on the first insulating structure and covering a side surface and a bottom surface of the first groove; a second insulation structure arranged on the first wiring layer, where at least one first through-hole is formed in the second insulation structure of the frame area; a first conductive structure covering a part of an upper surface of the second insulating structure and at least a sidewall and a bottom surface of the first via-hole.