Display Substrate Conductive Pattern for Electrostatic Charge Dissipation
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Solution Overview
Problem
Conventional display substrate manufacturing processes are prone to defects due to static electricity, particularly at overlapping areas of metal structures, which can break down insulation layers and cause electrical failures.
Innovation Solution
A manufacturing method that involves forming a first metal pattern, followed by insulation layers, and then a conductive layer, where the conductive layer is patterned to cover overlapping areas between metal patterns, effectively dispersing electrostatic charges during the patterning of insulation layers to prevent defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulation layers are formed in conventional display substrate manufacturing, then the display substrate structure is completed, but static electricity is generated causing defects to metal structures
Solution Approach 1:
A conductive layer is formed and patterned before patterning the insulation layer to create a conductive pattern that will dissipate static electricity during subsequent processing steps. This preliminary action prevents static electricity from causing defects to metal structures downstream in the manufacturing process.
Solution Approach 2:
The conductive pattern acts as an intermediary element between the insulation layer and metal structures. During insulation layer patterning, the conductive pattern provides a path for static electricity dissipation, protecting the metal structures from electrostatic damage without interfering with the insulation layer formation.
2Reliability
If the conductive layer is patterned to cover overlapping areas, then static electricity is dispersed preventing defects, but the manufacturing process complexity increases
Solution Approach 1:
The conductive layer patterning step is merged with the existing manufacturing process flow, utilizing the same patterning equipment and materials as other layers. The conductive pattern is integrated into the multi-layer structure without requiring separate dedicated processing equipment or materials, thus limiting the increase in manufacturing complexity.
3Manufacturing precision
If multiple layers are formed sequentially, then the display substrate structure is achieved, but the manufacturing time increases
Solution Approach 1:
The conductive layer is formed and patterned in advance before the insulation layer patterning step. This preliminary formation allows the conductive pattern to be in place to protect metal structures during subsequent processing, and the sequential layer formation maintains precise alignment through standard photolithographic registration techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents defects caused by electrostatic charges during the manufacturing process, ensuring the integrity of the display substrate by covering and dispersing charges across overlapping metal structure areas.
Implementation Method 1
an orthographic projection of the first conductive pattern on the base substrate at least covers the overlapping part
Data Source
AI summary
A manufacturing method of a display substrate, a display substrate and a display device are provided. The manufacturing method of a display substrate including: forming a first metal pattern forming a first insulation layer; forming a second metal pattern; forming a second insulation layer forming a first conductive layer; patterning the first conductive layer to form a first conductive pattern; patterning the second insulation layer to form a second insulation pattern; wherein, an orthographic projection of the first conductive pattern on the base substrate and an orthographic projection of the second metal pattern on the base substrate have an overlapping part; and during patterning the second insulation layer, an orthographic projection of the first conductive pattern on the base substrate at least covers the overlapping part.