Display Substrate Conductive Protection Structure for Etching Damage
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Solution Overview
Problem
In the process of forming a display substrate, the etching of insulation layers with large thicknesses can lead to a micro-trenching effect, damaging metal patterns and affecting yield due to prolonged etching times and poor contact between layers.
Innovation Solution
A ring-shaped conductive protection structure made of anti-dry-etching material is arranged around the edge of the first conductive pattern, overlapping with the via-hole projection on the substrate, preventing damage during dry etching and ensuring electrical connection between conductive patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulation layer thickness is increased to ensure electrical isolation between layers, then the insulation performance is improved, but the etching time is prolonged and micro-trenching effect occurs damaging the metal pattern
Solution Approach 1:
A protective structure is formed on the metal pattern before the insulation layer is deposited and before the via-hole etching process. This protective structure serves as a preliminary protective measure that prevents the metal pattern from being damaged during the subsequent long-duration etching process required for thick insulation layers.
Solution Approach 2:
The protective structure acts as a cushioning layer that absorbs or mitigates the harmful effects of the etching process on the metal pattern. By placing this protective layer beforehand, the metal pattern is shielded from direct exposure to etching ions, preventing micro-trenching and over-etching even during extended etching times required for thick insulation layers.
2Reliability
If the etching process is extended to fully penetrate thick insulation layers, then the via-hole connectivity is improved, but the metal pattern at the via-hole edge is etched and damaged
Solution Approach 1:
The protective structure serves as an intermediary element between the etching ions and the metal pattern. It allows the etching process to proceed fully through the insulation layer to achieve via-hole connectivity while simultaneously preventing the etching ions from directly attacking and damaging the metal pattern at the via-hole edges.
Solution Approach 2:
The protective structure converts the potentially harmful prolonged etching process into a beneficial outcome. By having the protective layer in place, the extended etching time required for thick insulation layers no longer results in metal pattern damage, thus transforming what would be a harmful condition into an acceptable or even beneficial process parameter.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive protection structure effectively prevents damage to the first conductive pattern during etching, maintaining the yield and integrity of the display substrate by shielding it from etching ions and reducing resistance.
Implementation Method 1
a ring-shaped conductive protection structure is arranged at an edge of a preset region of the first conductive pattern and surrounds the preset region, and the conductive protection structure is made of an anti-dry-etching material
Data Source
AI summary
A display substrate, a method for forming the display substrate and a display device are provided. The display substrate includes: a first conductive pattern located on a base substrate, where a ring-shaped conductive protection structure is arranged at an edge of a preset region of the first conductive pattern and surrounds the preset region, and the conductive protection structure is made of an anti-dry-etching material; an insulation layer covering the first conductive pattern; and a second conductive pattern located on a side of the insulation layer away from the first conductive pattern, where the second conductive pattern is electrically connected to the first conductive pattern through the via-hole.