Display Substrate Contact Pad Insulating Layer for Peel-Off Prevention
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Solution Overview
Problem
Electronic display devices face challenges with the 'peel-off' or 'lifting' phenomenon of conductive layers in contact pad portions, which affects their reliability and performance, particularly in achieving slimness, reduced weight, lower driving voltages, and smaller power consumption.
Innovation Solution
A display panel design featuring a base substrate with pixels-populated and surrounding areas, including first and second contact pad portions, an insulating layer with a specific thickness between them, and a conductive film on the pad portions, which prevents the lifting phenomenon by ensuring proper adhesion and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional display device structure is used, then the device achieves basic display function, but the conductive layer in contact pad portions experiences peel-off or lifting phenomenon
Solution Approach 1:
An insulating layer is introduced as an intermediary between the substrate and the conductive layer in contact pad portions. This insulating layer prevents direct contact between the conductive layer and substrate, eliminating the peel-off phenomenon by acting as a mediator that maintains proper adhesion and bonding conditions.
Solution Approach 2:
The insulating layer is selectively formed only in contact pad portions where the peel-off problem occurs, rather than uniformly across the entire substrate. This localized approach addresses the specific adhesion issue in contact pad areas while maintaining other structural properties elsewhere in the device.
2Reliability
If the insulating layer thickness is increased to prevent lifting, then adhesion is improved, but the device thickness increases
Solution Approach 1:
The thickness of the insulating layer is precisely controlled within a specific range (50-200 nm) to achieve the optimal balance between preventing peel-off and maintaining device slimness. By adjusting this critical parameter, the invention resolves the contradiction between bonding stability and device thickness.
Solution Approach 2:
Instead of using a thick insulating layer that would guarantee adhesion but increase device thickness, the invention applies a thin insulating layer with precisely controlled thickness that provides sufficient adhesion prevention while maintaining the slim profile required for modern display devices.
Data Source
AI summary
A display substrate, a display device having the same and a method of manufacturing the display substrate are provided. The display substrate includes a base substrate having a pixels-populated area (PA) and a surrounding area (SA) outside the PA, a first contact pad portion formed in the surrounding area, a second contact pad portion formed in the surrounding area formed to be spaced apart from the first contact pad portion with a spacing region provided therebetween, an insulating layer formed in the spacing region between the first and second contact pad portions and having a thickness smaller than or equal to a thickness of each of the first and second contact pad portions, and a first conductive film formed on the first and second pad portions.