Display Substrate Electrode and Semiconductor Layer Formation Sequence
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Solution Overview
Problem
In the manufacturing of display substrates for liquid crystal display devices, the existing process of forming a semiconductor layer followed by a protection layer and then the display electrode can lead to damage and over etching issues, affecting the performance and stability of the thin film transistor.
Innovation Solution
The method involves forming the first display electrode and semiconductor layer in the same layer, with the display electrode formed before the semiconductor layer, using a wet etching process and laser annealing to prevent over etching and simplify the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protection layer is formed after the semiconductor layer to prevent damage during display electrode formation, then the semiconductor layer is protected, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The display electrode is formed before the semiconductor layer, reversing the conventional sequence. This preliminary formation of the display electrode eliminates the need for a subsequent protection layer, as the semiconductor layer is deposited over the already-formed electrode rather than requiring protection during electrode formation.
Solution Approach 2:
The conventional sequence of forming the semiconductor layer first and then the display electrode is inverted. By forming the display electrode first and then depositing the semiconductor layer over it, the patent eliminates the need for a protection layer while preventing over-etching issues.
2Reliability
If a protection layer is formed after the semiconductor layer, then the semiconductor layer is protected, but the production time increases
Solution Approach 1:
The display electrode is formed in advance before the semiconductor layer deposition. This preliminary action eliminates the need for a separate protection layer formation step, directly reducing production time while maintaining the integrity of the semiconductor layer.
3Ease of manufacture
If wet etching is used for patterning both the display electrode and semiconductor layer, then the process is simplified, but over etching of the semiconductor layer occurs
Solution Approach 1:
The display electrode is formed first with its patterning completed before semiconductor layer deposition. When the semiconductor layer is subsequently patterned using wet etching, the display electrode is already in place to physically block the etchant, preventing over-etching while allowing the use of simple wet etching processes.
Solution Approach 2:
The display electrode acts as an intermediary protective barrier during the semiconductor layer patterning process. By being formed first, it serves as a physical shield that prevents the wet etching solution from excessively etching the semiconductor layer, thereby maintaining manufacturing precision.
4Manufacturing precision
If multiple layers are formed in conventional sequence, then each layer can be optimized, but the number of manufacturing steps increases
Solution Approach 1:
The display electrode is formed in advance before the semiconductor layer, allowing both layers to be optimized for their respective functions while reducing the total number of manufacturing steps by eliminating the protection layer requirement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach avoids over etching of the semiconductor layer, stabilizes the thin film transistor performance, and simplifies the manufacturing process while reducing the number of film layers and production costs, enhancing the display substrate's efficiency and light transmittance.
Implementation Method 1
a laser annealing treatment is performed on the first display electrode before forming the semiconductor material layer
Implementation Method 2
a wet etching method is adopted to etch the first conductive material layer so as to form the first display electrode
Implementation Method 3
a wet etching method is adopted to etch the semiconductor material layer so as to form the semiconductor layer
Data Source
AI summary
A display substrate and a manufacturing method thereof and a display device are disclosed. The manufacturing method of the display substrate includes: forming a first display electrode; and forming a thin film transistor, which includes forming a semiconductor layer; The first display electrode and the semiconductor layer are in one same layer, and a step of forming the first display electrode is performed before performing a step of forming the semiconductor layer.