Display Substrate Bonding Region Metal Pattern Erosion Control
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Solution Overview
Problem
In the manufacturing of microcircuits such as TFT-LCD and OLED displays, the increase in size and resolution leads to signal delay issues due to the lengthening of metal wires, causing uneven brightness and affecting display quality, as low-resistance metals used in metal electrodes react with etching solutions, resulting in conductivity loss and side surface erosion.
Innovation Solution
A display substrate design featuring a first metal pattern with a second metal pattern covering at least one side surface, where the activity of the second metal pattern is weaker than the first, preventing etching solution interaction and maintaining conductivity, comprising aluminum-based metals for the first pattern and metals like nickel, cobalt, or copper for the second pattern, which reduces side surface erosion and complexity in the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If low-resistance metal (e.g., aluminum) is used for metal patterns in bonding regions, then conductivity is improved, but the metal reacts with etching solutions causing side surface erosion and conductivity loss
Solution Approach 1:
A protective metal pattern is introduced as an intermediary layer between the etching solution and the low-resistance metal pattern. This protective layer (made of etching-resistant metals like tungsten, molybdenum, or titanium) mediates the interaction by being exposed to the etching solution instead of the aluminum, thereby preventing direct contact and subsequent erosion of the conductive metal while maintaining the desired electrical conductivity.
Solution Approach 2:
The invention employs a composite structure combining two different metal patterns: a low-resistance metal (aluminum-based) for high conductivity and an etching-resistant metal (tungsten, molybdenum, or titanium) for chemical stability. This composite approach allows each material to perform its optimal function - the aluminum provides electrical conductivity while the protective metal provides resistance to etching solution, eliminating the need for organic insulation layers.
2Object-affected harmful factors
If organic insulation layers are added to protect metal patterns from etching solutions, then etching resistance is improved, but manufacturing process complexity increases
Solution Approach 1:
The invention extracts and eliminates the organic insulation layer from the manufacturing process by replacing it with an inorganic protective metal pattern. This removal simplifies the manufacturing process by reducing the number of deposition and etching steps required, while still providing effective protection against etching solution interaction through the use of etching-resistant metals.
3Manufacturing precision
If metal wire length increases to accommodate larger display sizes and higher resolution, then display quality is improved, but signal delay increases causing uneven brightness
Solution Approach 1:
The invention changes the electrical parameters of the metal patterns by using low-resistance aluminum-based metals for the conductive pathways. This parameter change (reducing resistance) compensates for the increased wire length by maintaining signal integrity and reducing delay, thereby allowing larger display sizes and higher resolutions without suffering from uneven brightness caused by excessive signal delay.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces conductivity loss and manufacturing complexity, enhancing display quality by preventing etching solution interaction with the first metal pattern, thereby improving product yield and reducing production costs.
Implementation Method 1
an activity of a metal of the second metal pattern is weaker than an activity of a metal of the first metal pattern
Data Source
AI summary
Embodiments of the present disclosure provide a display substrate, a display panel, a display device, and a manufacturing method of the display substrate. The display substrate includes a display region and a peripheral region located at an outer side of the display region, and the peripheral region includes a bonding region. The display substrate includes: a base substrate, and a first metal pattern and a second metal pattern which are provided on the base substrate and located in the bonding region, the second metal pattern covers at least a portion of at least one side surface of the first metal pattern, and an activity of a metal of the second metal pattern is weaker than an activity of a metal of the first metal pattern.