Display Substrate Residual Sand Removal via Passivation Layer Segmentation
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Solution Overview
Problem
The manufacturing of display substrates often results in residual crystalline particles, known as 'residual sand,' which can adversely affect display performance by aggravating phenomena such as residual images, due to the inability to effectively remove these particles in typical etching processes.
Innovation Solution
A method involving the formation of a passivation layer with stacked sub-layers of different compactness, where a loose surface portion is easily removable, and specific etching solutions and plasma etching processes are used to remove a certain thickness of the passivation layer, thereby eliminating residual sand, including the use of hydrofluoric acid and controlled plasma etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If typical etching processes are used to remove residual sand, then the etching process can be completed, but residual crystalline particles remain and adversely affect display performance
Solution Approach 1:
The passivation layer is divided into multiple sub-layers with different compactness. The first passivation sub-layer has lower compactness and is designed to be easily removable, while the second passivation sub-layer has higher compactness and remains intact. This segmentation allows selective removal of the loose surface portion containing residual sand while preserving the compact underlying layer.
Solution Approach 2:
Different regions of the passivation layer are given different properties: the surface portion (first sub-layer) is made loose and easily etchable to facilitate residual sand removal, while the deeper portion (second sub-layer) is made compact and resistant to etching to maintain structural integrity and passivation function.
2Stability of the object's composition
If the passivation layer is made compact to ensure integrity, then structural stability is improved, but residual sand cannot be effectively removed
Solution Approach 1:
The passivation layer is segmented into two functional sub-layers: a compact second sub-layer that provides structural stability and integrity, and a loose first sub-layer that enables effective removal of residual sand through etching processes.
Solution Approach 2:
Instead of making the entire passivation layer loose for easy sand removal, only the necessary surface portion (first sub-layer) is made loose, while the deeper portion (second sub-layer) maintains compactness for structural integrity. This partial action achieves both goals without excessive compromise.
3Reliability
If the loose surface portion of the passivation layer is removed to eliminate residual sand, then display performance is improved, but the passivation layer structure is modified
Solution Approach 1:
The passivation layer is prepared in advance with a two-sub-layer structure during the formation process, where the first sub-layer is deliberately made loose and removable. This preliminary structuring enables subsequent easy removal of residual sand without requiring complex post-processing modifications.
Solution Approach 2:
The compactness parameter of the passivation layer is changed in a controlled manner: the first sub-layer is formed with lower compactness for easy removal, while the second sub-layer is formed with higher compactness for structural stability. This parameter differentiation simplifies the overall process by enabling selective etching.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the amount and density of residual sand, thereby suppressing display failures and improving the overall display performance by ensuring the removal of residual particles without compromising the passivation layer's integrity.
Implementation Method 1
The portion of the oxide conductive material layer in the exposure region of the photoresist pattern is wet etched by using a first etching solution
Implementation Method 2
the first etching solution and the second etching solution have a same composition and both contain hydrofluoric acid
Implementation Method 3
etching the portion of the first passivation sub-layer exposed through the hollow position by adopting an anisotropic plasma etching process to a preset depth in the first passivation sub-layer
Implementation Method 4
etching the remaining material of the portion of the first passivation sub-layer exposed through the hollow position by adopting an isotropic plasma etching process
Data Source
AI summary
The present disclosure provides a manufacturing method of a display substrate, a display substrate and a display device, belongs to the field of display technology, and can at least partially solve a problem of residual sand in the display substrate. The manufacturing method of the display substrate includes: providing a base; forming a passivation layer on a surface of the base; forming an amorphous oxide conductive material layer on a surface of the passivation layer facing away from the base; forming a photoresist pattern on the oxide conductive material layer, the photoresist pattern having an exposure region; etching a portion of the oxide conductive material layer in the exposure region of the photoresist pattern to form a hollow position exposing a portion of the passivation layer; and removing a certain thickness material of the portion of the passivation layer exposed through the hollow position.