Solid-State Devices TRIZ Cases

Branched scan lines route initialization signals to minimize dead space, reducing bezel width and enhancing display efficiency.

Interrupting source and base diffusion strips exposes the N- drift region for Schottky contacts, reducing die area penalty without changing cell pitch.

Segmenting the photosensor surface into regions with distinct non-linearity correction factors improves energy resolution in multiplexed PET systems.

Concavo-convex structures on driver integrated circuits slow resin flow, preventing air bubbles in adhesive members during display assembly.

Dummy active regions buffer substrate areas to prevent dishing effects and edge damage, improving manufacturing yield.

Segmented etching with a sacrificial liner removes polysilicon stringers to maintain narrow threshold voltage distribution for reliable memory cells.

A light emitting device uses a metal primer layer to adjust chromaticity coordinates, resolving manufacturing precision challenges.

An ESD analysis device simulates circuit potentials across different power supply systems to extract border cells and calculate potential differences.

Conductive layer protects copper interconnects during sputtering.

A single patterning process forms gate insulating, active, and source-drain metal layers using a multi-tone mask.

A light guide plate entry surface engages sealing resin elements to accommodate linearly arranged light-emitting diodes.

Segmented nozzles and gas curtains replace shadow masks, delivering uniform organic films while eliminating material waste.

Varying metal layer thickness in a cavity structure radiates heat from the chip while preventing electrical shorts between layers.

A semiconductor gate structure uses self-assembly material sidewalls to lower dielectric constant and improve metal film coverage.

Segmented charge storage regions in 3D NAND flash improve read characteristics by preventing unwanted charge accumulation through independent voltage control.

Offset-stacked semiconductor chips expose edge pads via vertical interconnectors, resolving pad accessibility issues in compact packages.

Imprinting creates recesses in a substrate layer for polar molecule redistribution into conductive grids.

An organic protective layer prevents oxygen and water permeation through photoresist, maintaining electrical performance in bending regions.

A sensor controller switches driving modes to measure capacitance variations between electrodes for body composition analysis.

A color filter uses a coloring agent absorbing 420 nm to 470 nm blue light to resolve spectrum mismatch and maintain color reproducibility.

A magnetic memory element uses a dielectric wall and conductive program line to apply gate voltage for dynamic anisotropy control.

Selective deposition and etching of augmentation material adjusts spacer dimensions, resolving non-uniform feature alignment caused by fixed spacing.

Filling particles with smaller sizes and aspect ratios disperse among wavelength conversion particles to improve adhesion.

Groove structures in OLED packaging layers enhance mechanical interlocking between inorganic and organic films, preventing peeling under bending stress.

A display device uses segmented opposite electrodes to cover pixel units while leaving transmissive areas uncovered.

A photoelectric conversion element uses a 4H-pyran compound in its organic layer to enhance exciton dissociation and charge transfer efficiency.

Hole injection erasure lowers initial voltage thresholds in virtual ground array memory cells.

Spacers offset bit line implants to block hot electron transport and prevent program disturb while maintaining device scalability.

Annealing organic layers induces phase separation to form a bulk heterojunction, enhancing exciton diffusion and dissociation efficiency.

A metal wire extends between pixels to uniformize upper electrode potential without reducing the light emission area.

Overlapping visible and infrared photosensors enable concurrent two-dimensional and three-dimensional imaging within a single pixel architecture.

Lateral light propagation through a waveguide layer increases the emission angle and improves brightness uniformity in surface light source modules.

A three-dimensional semiconductor memory device stacks nonvolatile cell sub-strings vertically to reduce horizontal area occupation.

Incorporating difluorothienothiophene units lowers HOMO energy levels, elevating open circuit voltage while maintaining solution processability.

A second substrate with a protruding portion positions the touch sensor and polarizing plate on an extended area.

A high resistance short circuit preventing layer separates electrodes in organic light emitting devices to block charge carrier flow.

Segmented host-dopant layers in a tandem structure prevent roll-off and extend device lifetime.

Segmented first metal layers bridge gate pads and upper conductors, reducing step height to prevent disconnections during conformal deposition.

A FinFET fabrication method forms gate dielectric structures with different thicknesses on the same semiconductor substrate.

Selective insulative growth creates covered void-spaces between adjacent digitlines in vertically-stacked memory arrays.

Alternating expanded and non-expanded sealant segments prevent voltage transmission electrode oxidation while maintaining strong adhesion.

Cell over periphery memory stacks input-output pads on the substrate bottom, resolving interface connectivity limits that restrict vertical integration density.

A single driving transistor time-divides red, green, and blue light emission to simplify pixel circuit wiring.

Orienting SGT pillar sidewalls on specific crystal planes optimizes carrier mobility in semiconductor structures.

Plasma etching uses gate electrode layer as intermediary to form window openings without damaging the underlying semiconductor surface.

A configurable computing array uses programmable memory to store look-up tables for complex math functions, enabling efficient hardware computation.

Tetradentate platinum complexes tune emission color via carbene substituents, resolving stability trade-offs in OLED fabrication.

A segmented electromagnetic plate system transfers light emitting elements between platforms using controlled magnetic attraction.

A compressive stress film forms on the amplifying transistor channel to manage local tensile forces in solid-state image pickup devices.

A window sensing portion integrates conductive layers with a light shielding member to detect touch inputs.