Driver IC Blocking Portion Prevents Resin Bubbles
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Solution Overview
Problem
In flat panel display devices, the movement of photocurable resin between the driver integrated circuit and the cover window can lead to air bubbles forming in the adhesive member, causing defects due to premature contact with the adhesive member before curing.
Innovation Solution
The driver integrated circuit incorporates concavo-convex structures with inclined surfaces, which slow down the resin's flow and increase the contact area with the adhesive layer, ensuring the resin is cured before contacting the adhesive member, thus preventing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If resin is injected between the driver integrated circuit and the cover window, then the display structure and components are protected from external impact, but air bubbles are generated in the adhesive member causing defects
Solution Approach 1:
The patent applies preliminary action by introducing a blocking portion that proactively prevents resin from reaching the adhesive member before the harmful contact can occur. The blocking portion is positioned in advance to intercept the resin flow path, stopping the resin before it can generate air bubbles in the adhesive member. This preventive measure resolves the contradiction by maintaining both the protective function of the resin and the reliability of the adhesive member.
Solution Approach 2:
The blocking portion acts as an intermediary element between the resin and the adhesive member. It serves as a physical barrier that mediates the interaction between these two components, preventing direct contact between the resin and adhesive member. This intermediary structure allows the resin to fulfill its protective role while simultaneously protecting the adhesive member from resin-induced defects.
2Ease of manufacture
If resin flows freely from the pad area to the display area, then the injection process is simple, but air bubbles are generated in the adhesive member
Solution Approach 1:
The patent applies segmentation by dividing the resin flow path into separate regions using the blocking portion. The blocking portion segments the continuous flow path into a first region (where resin can flow) and a second region (where resin is blocked). This segmentation allows the resin injection process to remain relatively simple while preventing resin from reaching the adhesive member, thus avoiding air bubble generation.
Solution Approach 2:
The blocking portion serves as an intermediary structure that modifies the resin flow without completely blocking the injection process. It allows resin to flow through the designated path while intercepting and redirecting resin that would otherwise reach the adhesive member. This intermediary approach maintains manufacturing simplicity while preventing defects.
3Area of stationary object
If the driver integrated circuit is disposed close to the pad electrodes, then the device layout is compact, but resin can easily contact the adhesive member causing defects
Solution Approach 1:
The blocking portion acts as an intermediary barrier between the driver integrated circuit area and the adhesive member. Even when the driver integrated circuit is positioned close to the pad electrodes for compact layout, the blocking portion intercepts resin flow and prevents it from reaching the adhesive member. This intermediary structure enables compact design while maintaining reliability.
Solution Approach 2:
The patent extracts the problematic interaction between resin and adhesive member by removing the direct flow path between them. The blocking portion extracts or removes the possibility of resin contact with the adhesive member, allowing the driver integrated circuit to be positioned closer to the pad electrodes without compromising reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents defects by ensuring the photocurable resin is cured before contacting the adhesive member, enhancing adhesion between the driver integrated circuit and the adhesive layer while maintaining the display device's integrity.
Implementation Method 1
The driver integrated circuit incorporates concavo-convex structures with inclined surfaces, which slow down the resin's flow
Implementation Method 2
ensuring the resin is cured before contacting the adhesive member
Data Source
AI summary
A display device including a lower substrate, a display structure, pad electrodes, and a driver integrated circuit. The lower substrate has a display area and a pad area. The display structure is disposed in the display area on the lower substrate. The pad electrodes are disposed in the pad area on the lower substrate while being spaced apart from each other in a first direction. The driver integrated circuit is spaced apart from the pad electrodes in the second direction in the pad area on the lower substrate, and includes a circuit portion and a first blocking portion spaced apart from the circuit portion in a second direction perpendicular to the first direction.