Light-Emitting Element Resin Encapsulation Electrode Formation
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Solution Overview
Problem
The existing methods for manufacturing semiconductor light-emitting elements with protective elements result in complex electrical conduction structures, complicating the manufacturing process and making it difficult to mount these devices on wiring boards efficiently.
Innovation Solution
A method involving a light-emitting element with an anode and cathode on one surface and a protective element with terminals on another surface, where a resin composition covers and cures to form electrodes that connect the elements, simplifying the manufacturing process and enabling easier mounting on wiring boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If each of the semiconductor light-emitting element and the protective element is connected to a respective electrode on the supporting substrate, then electrical connection is achieved, but the structure of the supporting substrate and electrodes becomes complicated
Solution Approach 1:
The patent merges the supporting substrate function with the electrical connection function by forming electrodes directly on the supporting substrate in a simplified pattern. Instead of separate complex electrode structures for each element, the substrate integrates both support and electrical connection roles, reducing overall structural complexity while maintaining reliable electrical connections to both the light-emitting element and protective element.
2Reliability
If a complicated electrical conduction structure is formed on the substrate, then electrical connection is achieved, but the manufacturing process becomes complicated
Solution Approach 1:
The patent segments the electrical connection structure into distinct, simplified regions: a first electrode region for connecting to the light-emitting element and a second electrode region for connecting to the protective element. This segmentation allows each electrode to be formed independently with simpler geometry, reducing manufacturing complexity compared to a single complex interwoven electrode structure, while ensuring reliable electrical connections to both elements.
3Reliability
If electrodes are disposed on the supporting element for connecting protective element and light-emitting element, then electrical connection is achieved, but the manufacturing process is complicated
Solution Approach 1:
The supporting substrate is designed with multi-functionality, serving both as the mechanical support for the elements and as the base for integrated electrode formation. The substrate's surface is utilized for both element mounting and electrode patterning, eliminating the need for separate electrode carriers or complex interconnection structures, thereby simplifying the manufacturing process while ensuring reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process and facilitates secure, easy mounting of light-emitting devices on wiring boards by forming electrodes that connect the light-emitting and protective elements, reducing the complexity of the electrical conduction structure.
Implementation Method 1
curing the resin composition
Data Source
AI summary
A method of manufacturing a light emitting device includes: placing a light-emitting element above a light-transmitting portion of a first resin layer; placing a protective element above the first resin layer or a first surface of the light-emitting element; forming a second resin layer on the first resin layer so as to cover an entirety of the light-emitting element and an entirety of the protective element; removing a portion of the second resin layer such that an anode and a cathode of the light-emitting element and a first electrically-conductive structure and a second electrically-conductive structure of the protective element are exposed from the second resin layer; and forming a first electrode, which is electrically connected to the anode and the first electrically-conductive structure, and a second electrode, which is electrically connected to the cathode and the second electrically-conductive structure.