OLED Packaging Groove Structure for Adhesion

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Solution Overview

Problem

Conventional OLED display technology faces issues with poor stability and adhesion between inorganic and organic layers in thin film packaging, leading to peeling and invasion of external water, oxygen, and impurities, which degrades the display panel's quality, especially under bending or lateral stress.

Innovation Solution

The OLED display panel incorporates a groove structure in the packaging layer, with specific grooves and protrusions on the inorganic and organic layers to enhance adhesion and stability, and a multi-layer packaging structure to reduce peeling risks, including a first inorganic layer, first organic layer, second inorganic layer, and additional organic and inorganic layers with corresponding grooves and protrusions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a conventional flat and smooth thin film packaging structure is used, then the manufacturing process is simple, but the adhesion between inorganic and organic layers is poor, causing peeling under bending stress

Engineering Contradiction:
Improveadhesion between inorganic and organic layersVSAvoidpackaging layer structure
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent introduces groove structures with curved surfaces into the packaging layers. Specifically, first and second grooves are formed in the first and second inorganic packaging layers respectively, creating curved interface geometries that mechanically interlock with the organic packaging layer, thereby significantly improving adhesion strength and preventing peeling under bending stress.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The groove structures create controlled porous or cavity-like regions within the packaging layers. These grooves increase the surface area and provide mechanical anchoring points for the organic packaging layer, enhancing the overall adhesion between different material layers without compromising the protective function.

Inventive Principle:
Principle #31Porous materials

2Reliability

If the packaging layers are made with strong adhesion to prevent peeling, then the bending ability is improved, but the internal stress increases causing misalignment

Engineering Contradiction:
Improvestability of packaging layersVSAvoidalignment of packaging layers
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The packaging structure is segmented into multiple functional zones through the groove structures. The grooves divide the packaging layers into distinct regions that can independently accommodate stress, allowing each segment to maintain its alignment while contributing to overall adhesion. This segmentation prevents stress concentration that would cause misalignment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The groove structures introduce asymmetric features into the otherwise symmetric multi-layer packaging structure. The grooves are positioned and dimensioned to create asymmetric stress distribution patterns that favor alignment maintenance while providing enhanced adhesion in critical regions, preventing both peeling and misalignment.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS11404668B2Organic light emitting diode display panel having groove structure in thin film packaging layer to improve adhesion and method of manufacturing thereof
Publication Date: 2022.08.02 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
  • US11404668B2 patent drawing
  • US11404668B2 patent drawing
  • US11404668B2 patent drawing

AI summary

An organic light emitting diode (OLED) display panel and a method of manufacturing the same are provided. The OLED display panel includes a base substrate, a thin film transistor layer, an OLED device layer and a packaging layer sequentially disposed. The packaging layer includes a first inorganic packaging layer, a first organic layer and a second inorganic packaging layer sequentially disposed. The first inorganic packaging layer is formed with a first groove and the first organic packaging layer is formed with a second groove.