Display Substrate via Segmented Via Holes and Seed Layer
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Solution Overview
Problem
The manufacturing process of display substrates with light emitting elements is complicated due to the difficulty in forming deep holes through flexible base substrates for metal injection, which complicates the connection between external control circuits and light emitting diodes.
Innovation Solution
A method involving a seed layer and multiple metal injection steps to form connection terminals, avoiding the need for deep holes through the entire substrate, using laser etching for via hole formation and sacrificial layers for carrier substrate removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If deep holes are formed through flexible base substrates for metal injection, then connection between external control circuits and light emitting diodes is achieved, but the manufacturing process becomes complicated
Solution Approach 1:
The patent divides the single deep hole formation process into multiple shallow hole formation steps. Instead of forming one deep hole through the entire flexible base substrate, the method forms multiple shallow holes in sequence, each extending only partway through the substrate thickness. This segmentation reduces the difficulty of each individual hole formation step and simplifies the overall manufacturing process while maintaining reliable electrical connection.
Solution Approach 2:
The patent performs preliminary actions by forming shallow holes and injecting metal before the substrate is completely processed. The metal injection is performed into shallow holes that are formed during intermediate stages of substrate manufacturing, rather than attempting to form deep holes through the finished substrate. This preliminary action approach simplifies subsequent processing steps.
2Reliability
If deep holes are formed through flexible base substrates for metal injection, then electrical connection is established, but production costs increase
Solution Approach 1:
The patent segments the deep hole formation and metal injection process into multiple shallow hole formation and injection steps. This segmentation reduces the complexity and cost of each individual step, as forming shallow holes requires less precise equipment and fewer processing resources than forming deep holes through the entire substrate thickness.
Solution Approach 2:
The patent applies partial action by forming holes that extend only partway through the substrate rather than completely through it. This partial penetration approach reduces the difficulty and cost of hole formation and metal injection, while still achieving the necessary electrical connection function when combined with subsequent processing steps.
3Ease of manufacture
If deep holes are formed through flexible base substrates, then metal injection is possible, but filling metal into deep holes becomes challenging
Solution Approach 1:
The patent divides the metal injection process into multiple sequential injections into shallow holes, rather than attempting a single injection into a deep hole. Each shallow hole can be filled more precisely and completely, ensuring reliable metal contact with the seed layer. This segmented approach eliminates the filling challenges associated with deep holes.
Solution Approach 2:
The patent performs preliminary shallow hole formation and metal injection before the substrate undergoes final processing. By injecting metal into shallow holes during intermediate manufacturing stages, the process takes advantage of the substrate's more accessible structure, making metal filling easier and more precise compared to injecting into deep holes through the finished substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the manufacturing process, reduces production costs, and avoids the challenges of filling metal into deep holes, enhancing the reliability and yield of display substrates.
Implementation Method 1
using laser etching for via hole formation
Data Source
AI summary
Embodiments of the present disclosure provide a display substrate, a method for manufacturing a display substrate, and a display device. The method for manufacturing the display substrate includes: providing a seed layer on a first carrier substrate and forming a base substrate covering the seed layer; forming a first connection terminal on a side of the base substrate away from the first carrier substrate, the first connection terminal electrically connecting to the seed layer; removing the first carrier substrate to expose the seed layer; and forming a second connection terminal electrically connecting to the seed layer.