Display Substrate Trench Structure for Narrow Frame

The conductive wire transitions from a planar structure to a three-dimensional structure by extending into the insulating layer through trenches. This vertical dimension allows the wire to maintain low resistance through increased effective width while occupying less horizontal space in the non-display area, directly resolving the contradiction between resistance reduction and area minimization.

The insulating layer is segmented by introducing trenches that divide it into multiple regions. The conductive wire is positioned within these segmented trench structures, allowing it to achieve an effectively wider path for current flow while the segmentation confines the wire to specific zones, preventing excessive expansion into the non-display area.

By extending the conductive wire vertically into the insulating layer through trenches, the effective conduction path width is increased without proportionally increasing the horizontal frame width. This dimensional transition allows resistance reduction while maintaining a compact frame structure.

The conductive wire is nested within the trench structures formed in the insulating layer. This nesting arrangement allows the wire to utilize the vertical space within the insulating layer, achieving an effectively wider conduction path while the outer boundary (frame width) remains determined by the substrate edges, not the wire expansion.