Display Panel Substrate Via-Hole Filling for Light Leakage Control

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Solution Overview

Problem

Existing display panels face challenges with light leakage due to the large size of via holes in the insulating layer, which affects the aperture ratio and display quality.

Innovation Solution

A substrate with sub-pixel structures arranged in an array, featuring a thin film transistor, an insulating layer with a filling block at the via hole, and a light shielding pattern to improve flatness and reduce light leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If via holes in the insulating layer are made large to ensure electrical connection, then electrical conductivity is improved, but light leakage increases and aperture ratio decreases

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidlight leakage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a light shielding layer as an intermediary substance filling the via hole. This light shielding layer blocks light from passing through the via hole while maintaining the electrical connection between the pixel electrode and the electrode below. The intermediary material thus simultaneously addresses both the electrical connectivity requirement and the light leakage prevention requirement.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies local quality by making the via hole structure non-uniform: the upper part has a larger opening for reliable electrical connection, while the lower part is filled with light shielding material to prevent light leakage. This local differentiation of structure and material properties allows the via hole to fulfill both electrical and optical requirements in different spatial zones.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If via holes are made large for manufacturing ease, then manufacturing precision is improved, but aperture ratio and display quality deteriorate

Engineering Contradiction:
Improvevia hole formation easeVSAvoidaperture ratio
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent applies preliminary action by forming the light shielding layer inside the via hole before completing the electrode structure. This preliminary filling of the via hole with light shielding material ensures that when the electrode is formed, the via hole already has the appropriate structure to prevent light leakage, allowing the electrode to be formed with greater ease without compromising aperture ratio.

Inventive Principle:
Principle #10Preliminary action

3Device complexity

If no light shielding structure is added to maintain device simplicity, then device complexity is reduced, but light leakage increases

Engineering Contradiction:
Improvestructure complexityVSAvoidlight leakage
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The light shielding layer serves multiple functions simultaneously: it acts as a light blocking barrier, provides structural support within the via hole, and facilitates the formation of the electrode structure. This multi-functionality allows the device to achieve light leakage prevention without adding separate dedicated light shielding components, thus maintaining relative structural simplicity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS12235558B2Substrate, method for manufacturing same, and display panel
Publication Date: 2025.02.25 BOE TECHNOLOGY GROUP CO LTD
  • US12235558B2 patent drawing
  • US12235558B2 patent drawing
  • US12235558B2 patent drawing

AI summary

Provided is a substrate. The substrate includes a base substrate; and a plurality of sub-pixel structures arranged in an array on the base substrate, wherein the sub-pixel structure comprises: a thin film transistor disposed on the base substrate, the thin film transistor comprising a source and a drain; an insulating layer disposed on a side of the thin film transistor distal from the base substrate, a first via hole being formed in the insulating layer; a pixel electrode disposed on a side of the insulating layer distal from the base substrate, the pixel electrode being electrically connected to either the source or the drain through the first via hole; and a filling block disposed at the first via hole.