Display Substrate Via Hole Electrode Connection
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Solution Overview
Problem
The manufacturing process of display panels with touch functions is complicated due to the need for multiple masking processes to insulate and connect column and row electrodes, which increases complexity and cost.
Innovation Solution
A display substrate design where first and second touch electrodes are electrically connected to conductive lines through via holes in the base substrate, eliminating the need for additional insulating layers and bridging metals, and allowing for a simplified manufacturing process by using the base substrate as an insulating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional insulating layers and bridging metals are added to insulate and connect electrodes, then the touch functionality is achieved, but the manufacturing process complexity increases
Solution Approach 1:
The base substrate serves dual functions as both the structural support and the insulating layer. The via holes directly connect the touch electrodes to the conductive lines through the base substrate, eliminating the need for separate insulating layers and bridging metal structures, thus simplifying the manufacturing process while maintaining touch functionality
Solution Approach 2:
The base substrate is designed to perform multiple functions simultaneously: it provides mechanical support, electrical insulation between the touch electrodes and conductive lines, and structural integration for the via holes. This multi-functionality reduces the number of additional components needed
2Reliability
If additional insulating layers and bridging metals are added, then electrode insulation and connection are achieved, but the number of manufacturing steps increases
Solution Approach 1:
The insulation function is merged into the base substrate itself, and the connection function is achieved through direct via holes. This combination eliminates the need for separate insulating layers and bridging metal deposition steps, reducing manufacturing steps while ensuring reliable electrode insulation and connection
Solution Approach 2:
The complex multi-layer insulating and bridging metal structures are extracted and replaced by the simpler via hole structure that directly penetrates the base substrate. This extraction removes unnecessary manufacturing steps while maintaining the essential insulation and connection functions
3Manufacturing precision
If multiple masking processes are added for insulating layer and bridging metal, then precise electrode connection is achieved, but the manufacturing cost increases
Solution Approach 1:
The positioning and connection functions are merged into the via hole structure, which is formed using existing alignment systems from the display manufacturing process. This eliminates the need for additional masking processes while maintaining precise electrode connection, thereby reducing manufacturing cost
Data Source
AI summary
A display substrate, a method for manufacturing the same and a display device are provided. The display substrate includes a base substrate, wherein a plurality of first touch electrodes is separated from each other and arranged on a first surface of the base substrate, first conductive lines and second conductive lines intersect each other and are arranged on a second surface of the base substrate, and each of the first touch electrodes is electrically connected to the first conductive line through the respective first via hole penetrating the base substrate.