Double-Sided Display Substrate Via Connection for Thermal Reliability
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Solution Overview
Problem
In the manufacturing of display substrates, the metal material filled in via holes often disconnects from the conductive material in through holes due to thermal expansion differences, leading to reduced production yield and reliability of the backplane.
Innovation Solution
Fabricating functional structures on both sides of the substrate first, then forming a via hole that penetrates both, and creating a conductive connection portion within the via hole to electrically connect the patterns, thereby preventing disconnection during subsequent high-temperature processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If metal material is filled in via holes before fabricating functional structures, then the via holes can be formed early in the process, but the metal material is easily disconnected from the conductive material during subsequent fabrication processes
Solution Approach 1:
The patent applies preliminary action by fabricating the via holes and filling them with metal material before fabricating the functional structures. This allows the via holes to be prepared in advance, improving manufacturing efficiency. The method then ensures reliability by forming through holes that correspond to the via holes and filling them with conductive material that makes good electrical contact with the pre-filled metal material.
Solution Approach 2:
The patent segments the conductive connection into two parts: metal material filled in the via holes and conductive material in the through holes. This segmentation allows each part to be optimized independently - the metal material provides structural support and initial conduction path, while the conductive material ensures reliable electrical contact with the functional structures.
2Reliability
If via holes are fabricated after functional structures are made, then the conductive connection is more reliable, but the manufacturing process becomes more complex and less efficient
Solution Approach 1:
The patent performs preliminary action by creating via holes and filling them with metal material before fabricating functional structures. This preliminary preparation simplifies the overall process by establishing the conductive path early, avoiding the need for complex post-processing steps to create connections after all functional structures are in place.
3Reliability
If metal material is used in via holes for conductive connection, then the electrical connection between upper and lower surfaces is achieved, but thermal expansion differences cause disconnection during high-temperature processes
Solution Approach 1:
The patent uses composite materials by combining metal material in via holes with conductive material in through holes. This composite approach allows the metal to provide structural stability and the conductive material to ensure reliable electrical contact, compensating for thermal expansion differences and preventing disconnection during high-temperature processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the production yield and reliability of the backplane by maintaining the conductive connection between functional patterns on the upper and lower surfaces, reducing frame width, and improving manufacturing efficiency.
Implementation Method 1
irradiating a via hole region in the edge region where the via hole is to be fabricated with a laser, to burn the first functional structure, the first organic substrate, the cured prepreg, the second organic substrate and the second functional structure in the via hole region to form the via hole
Data Source
AI summary
A method for manufacturing a display substrate includes: fabricating a first functional structure on a first side of a common substrate, and fabricating a second functional structure on a second side of the common substrate; fabricating a via hole in an edge region of the common substrate; and fabricating a conductive connection portion in the via hole, a first end of the conductive connection portion on the first side extending out of the via hole and coupled to a first functional pattern in the first functional structure, and a second end of the conductive connection portion on the second side extending out of the via hole and coupled to a second functional pattern in the second functional structure. The method provided in embodiments of the present disclosure is applied to the manufacturing of a display substrate.