Display Device Terminal Recess for Insulating Layer Etching
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Solution Overview
Problem
The existing manufacturing process for display devices with organic electroluminescence (organic EL) materials is complicated due to the need for multiple etching steps to remove stacked inorganic and organic insulating layers from terminal regions, increasing processing time and reducing margins.
Innovation Solution
A method involving the formation of recessed portions on connection terminals, allowing for the sequential and continuous deposition of inorganic and organic insulating layers, which are then etched together in a single step, simplifying the process and improving exposure of conductive surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple etching steps are used to remove stacked inorganic and organic insulating layers from terminal regions, then complete removal of insulating layers is achieved, but manufacturing process complexity increases and processing time is extended
Solution Approach 1:
The terminal region is segmented into a first terminal region and a second terminal region. The first inorganic insulating layer is selectively removed from the first terminal region, while the second inorganic insulating layer is selectively removed from the second terminal region. This segmentation allows different etching conditions to be applied to different regions, achieving complete removal without requiring multiple sequential etching steps across the entire terminal region, thus reducing process complexity while maintaining precision.
2Manufacturing precision
If multiple etching steps are used to remove stacked inorganic and organic insulating layers, then complete removal is achieved, but tact time is increased
Solution Approach 1:
The terminal region is divided into first and second terminal regions, allowing simultaneous or parallel processing. The first etching process removes the first inorganic insulating layer from the first terminal region, while the second etching process removes the second inorganic insulating layer from the second terminal region. This parallel processing approach significantly reduces the total tact time compared to sequential processing, while ensuring complete removal of all insulating layers.
Solution Approach 2:
The organic insulating layer is removed in advance before the inorganic insulating layers are etched. This preliminary action simplifies subsequent etching processes by removing the organic layer that would otherwise interfere with the etching of inorganic layers, allowing for more efficient and faster removal of the remaining insulating layers without requiring additional intermediate processing steps.
3Manufacturing precision
If multiple etching steps are used with different etching conditions for each insulating layer, then selective removal is achieved, but the number of processing chambers required increases
Solution Approach 1:
The terminal region is segmented into first and second terminal regions that can be processed in the same processing chamber simultaneously. By spatially separating the processing zones within a single chamber, different etching conditions can be applied to different regions without requiring multiple chambers. The first etching process with first etching conditions removes the first inorganic insulating layer from the first terminal region, while the second etching process with second etching conditions removes the second inorganic insulating layer from the second terminal region, all within one chamber.
4Reliability
If insulating layers extend to terminal regions, then protective coverage is provided, but conductive surfaces are obscured requiring removal
Solution Approach 1:
The terminal region is segmented into first and second terminal regions with different processing requirements. The first inorganic insulating layer is selectively removed from the first terminal region to expose the conductive surface, while the second inorganic insulating layer is selectively removed from the second terminal region. This selective removal approach maintains protective coverage where needed while exposing conductive surfaces only in specific terminal regions where electrical connection is required, balancing protection and accessibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces processing time, and enhances the reliability and stability of connection terminals by reducing the number of etching steps and improving the coverage of conductive layers.
Implementation Method 1
the inorganic layers are formed by sputtering
Data Source
AI summary
A manufacturing method of a display device including a pixel region including a plurality of pixels each including a light emitting element and a terminal region provided outside the pixel region and including connection terminals; the method comprising: forming a recessed portion in a part of a top surface of each of the connection terminals; forming a first inorganic insulating layer, an organic insulating layer, and a second inorganic insulating layer sequentially in the pixel region and continuously in the terminal region; and etching the first inorganic insulating layer and the second inorganic insulating layer in an area where the first inorganic insulating layer and the second inorganic insulating layer are stacked directly, the area being on the top surface except the recessed portion.