Display Device Terminal Exposure via Segmented Bonding
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Solution Overview
Problem
Existing display device manufacturing methods face challenges in efficiently exposing conductive terminals due to the formation of sealing layers, leading to decreased yield and difficulty in removing insulation materials without damaging the terminal surfaces.
Innovation Solution
A method involving bonding substrates with specific bonding materials, where a second bonding material with stronger adhesion covers the terminal region, allowing for precise removal of the second substrate and exposure of terminals by cutting between the terminal and display regions, facilitating the separation of display devices while maintaining the integrity of the terminal surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing layer is formed covering the terminal, then the terminal is protected from deterioration, but the conductive surface of the terminal cannot be exposed for connection
Solution Approach 1:
The patent divides the bonding material into two distinct segments: a first bonding material with weaker adhesion in the display region, and a second bonding material with stronger adhesion covering the terminal region. This segmentation allows selective removal of the sealing layer and organic layers over the terminal area while maintaining integrity in the display region, enabling terminal exposure without damaging the terminal surface.
Solution Approach 2:
The patent applies different adhesion characteristics to different regions of the bonding material. The second bonding material covering the terminal has stronger adhesion to the second substrate compared to the first bonding material in the display region. This local quality difference enables precise control over where layers are removed, allowing the sealing layer to be removed over the terminal while protecting other areas.
2Ease of manufacture
If the sealing layer is removed to expose the terminal, then the terminal becomes accessible for connection, but the terminal surface may be damaged
Solution Approach 1:
The patent performs preliminary action by forming the second bonding material with stronger adhesion in the terminal region before the removal process. This pre-established strong adhesion relationship between the second bonding material and the second substrate ensures that when the sealing layer and organic layers are removed, they detach cleanly without exerting damaging forces on the terminal surface.
Solution Approach 2:
The second bonding material acts as an intermediary layer between the terminal region and the second substrate. Its stronger adhesion creates a controlled detachment interface, allowing the sealing layer and organic layers to be removed as a unified structure while the terminal remains securely attached to the first substrate, preventing terminal surface damage.
3Ease of manufacture
If a separation layer is formed above the terminal, then the sealing layer can be removed with the opposing substrate, but the process becomes more complex
Solution Approach 1:
The second bonding material serves multiple functions simultaneously: it acts as an adhesion layer bonding the first and second substrates, serves as a protective layer covering the terminal during manufacturing, and functions as a release layer that enables clean separation of the sealing layer and organic layers from the terminal region. This multi-functionality eliminates the need for a separate dedicated separation layer, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the yield of terminal exposure by securely removing the sealing layer and insulation material, ensuring the conductive surface of the terminal is exposed without damage, thereby enhancing the manufacturing efficiency and reliability of display devices.
Implementation Method 1
the second bonding material having a stronger adhesion per unit area with respect to the second substrate than the first bonding material
Data Source
AI summary
A method of manufacturing a display device includes bonding together a first substrate and a second substrate sandwiching a first bonding material and a second bonding material, a substrate being formed by bonding the first and the second substrate and including a plurality of the display devices, the first bonding material being arranged in at least a display region, the second bonding material being a part of a terminal region and being arranged so as to cover the terminal, and the second bonding material having a stronger adhesion per unit area with respect to the second substrate than the first bonding material; cutting the second substrate at a cutting position between the terminal region and the display region for each of the display devices; removing the second substrate of the terminal region from the display device; and separating each of the display devices from the plurality of display devices.