Display Device Test Loops for IC Bonding Resistance Measurement
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Solution Overview
Problem
The existing methods for measuring IC bonding resistance in display devices, particularly in-vehicle displays, are inefficient and inaccurate due to the need for manual probing and estimation of in-plane wire resistance, leading to significant time and labor costs, as well as measurement errors.
Innovation Solution
A display device and test method that utilizes a metal layer with specific panel and circuit board pads, forming test loops to measure IC bonding resistance by comparing the resistance values of these loops, eliminating the need for manual probing and improving accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual probing and estimation methods are used to measure in-plane wire resistance, then measurement capability is achieved, but measurement precision deteriorates due to operator errors and estimation inaccuracies
Solution Approach 1:
The measurement path is segmented into two separate test loops: a first test loop containing the in-plane wire and a second test loop without it. By measuring each loop separately and subtracting the resistance values, the in-plane wire resistance can be isolated and calculated without manual probing, thereby improving measurement precision while reducing operational complexity.
Solution Approach 2:
A test signal is introduced as an intermediary to automatically traverse the test loops and enable resistance measurement. This eliminates the need for manual probing operations, reduces operator error, and improves both measurement precision and ease of operation through automated electrical measurement.
2Productivity
If manual probing methods are used to measure in-plane wire resistance, then resistance value can be obtained, but loss of time increases due to time-consuming manual operations
Solution Approach 1:
The test loops are pre-configured during manufacturing with designated test terminals and measurement paths. This preliminary setup eliminates the need for time-consuming manual probing during actual measurements, as the measurement path is already established and ready for automated testing, thereby improving productivity and reducing measurement time.
Solution Approach 2:
The measurement system is designed to be self-sufficient with integrated test terminals and automated measurement capabilities. The system performs its own measurement function without requiring external manual intervention for probing or data collection, significantly reducing measurement time and improving operational efficiency.
3Ease of operation
If theoretical calculation methods are used to determine IC bonding resistance, then measurement process is simplified, but measurement precision deteriorates due to reliance on estimated values
Solution Approach 1:
A test signal serves as an intermediary to enable direct electrical measurement of resistance values through the test loops. This replaces theoretical calculations with actual measured data, maintaining the simplicity of the measurement process while dramatically improving accuracy by using real electrical measurements rather than estimated theoretical values.
Solution Approach 2:
The manual mechanical probing process is replaced with an automated electrical measurement system. Test terminals and electrical signals substitute for manual probes and calculations, simplifying the operation while providing precise measured values instead of theoretical estimates.
4Measurement precision
If automated test loops are implemented to measure resistance, then measurement precision is improved, but device complexity increases due to additional metal layers and test structures
Solution Approach 1:
The test loops utilize existing metal layers and circuit structures for dual purposes: both for normal device operation and for resistance measurement. By making the measurement structures multi-functional, the patent improves measurement precision without significantly increasing overall device complexity, as the same structural elements serve multiple functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for a simpler, more accurate measurement of IC bonding resistance by directly calculating the value from the difference between test loop resistances, reducing labor costs and measurement errors while ensuring high precision.
Implementation Method 1
a first chip pad, a first panel pad, a first metal wire of the metal layer, a second panel pad, a first circuit board pad, a first internal wire of the flexible circuit board, a third circuit board pad, and a first control board pad are connected in sequence to form a first branch
Data Source
AI summary
A display device includes a substrate and a metal layer, and is bonded to a driver chip and a flexible circuit board; where first chip pad, first panel pad, first metal wire of the metal layer, second panel pad, first circuit board pad, first internal wire of the flexible circuit board, third circuit board pad, and first control board pad connected in sequence to form first branch; second metal wire of the metal layer, third panel pad, second circuit board pad, second internal wire of the flexible circuit board, fourth circuit board pad, and second control board pad connected in sequence to form second branch; first chip pads of two first branches electrically connected through third metal wire of the metal layer to form first test loop; and second metal wires of two second branches electrically connected through fourth metal wire of the metal layer to form second test loop.