Display Device With Through-Hole Connectors To Prevent Bending Cracks
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Solution Overview
Problem
Conventional display devices face challenges in achieving a narrow bezel due to the placement of the driving circuit board, which can lead to cracking from bending stress and requires a mask process for removing inorganic insulating layers, increasing manufacturing costs and reducing reliability.
Innovation Solution
The display device employs conductive connectors connected to signal pads within through holes extending through the substrate, allowing the driving circuit board to be placed at the lower surface, eliminating the need for bending and reducing the bezel area, thus preventing cracks and minimizing manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the driving circuit board is attached to the signal pads in the bezel area, then electrical connection is achieved, but the bezel area cannot be minimized and bending stress causes cracks
Solution Approach 1:
The patent moves the driving circuit board from the lateral bezel area to the lower surface of the substrate, utilizing the vertical dimension (Z-axis) instead of the lateral plane. This dimensional transition allows the circuit board to be positioned at the lower surface where it can be electrically connected to signal pads through conductive connectors extending through the substrate, thereby minimizing the bezel area while avoiding bending stress that would occur in conventional lateral configurations
Solution Approach 2:
Instead of attaching the driving circuit board to the upper surface or lateral edges of the substrate as in conventional designs, the patent inverts the arrangement by positioning the circuit board at the lower surface of the substrate. This inversion eliminates the need for bending the bezel area and prevents crack generation while maintaining electrical connectivity through vertically extending conductive connectors
2Area of stationary object
If the bezel area is bent to minimize display area, then narrow bezel is achieved, but bending stress generates cracks requiring mask process
Solution Approach 1:
The patent eliminates the need for bending the bezel area by transitioning to a vertical configuration where conductive connectors extend through the substrate thickness. The driving circuit board is positioned at the lower surface, connecting to signal pads via these vertical connectors, thereby achieving narrow bezel without lateral bending that would require mask processes for inorganic insulating layer removal
Solution Approach 2:
The patent extracts the driving circuit board from the lateral bezel area and relocates it to the lower surface of the substrate. This extraction eliminates the need for bending operations and the associated mask processes for removing inorganic insulating layers, simplifying the manufacturing process while achieving the narrow bezel objective
3Area of moving object
If conventional bending structure is used to minimize bezel, then display area is maximized, but reliability decreases due to crack generation
Solution Approach 1:
The patent maximizes display area while maintaining high reliability by transitioning to a vertical connector configuration. Conductive connectors extend through the substrate thickness to connect signal pads on the upper surface to the driving circuit board on the lower surface, eliminating lateral bending stress that would compromise reliability, thereby allowing full utilization of the substrate area for display purposes
Data Source
AI summary
A display device comprises a substrate having through holes; a driving circuit board disposed at a lower surface of the substrate; signal pads disposed in the through holes; and conductive connectors each connected to the driving circuit board and a corresponding one of the signal pads, wherein the conductive connectors are surrounded by the corresponding signal pad in a corresponding one of the through holes to achieve reliability in a manufacturing process and a reduction in manufacturing costs by remove the bending area that can cause cracks caused by bending stress.