Display Substrate Through-Hole Layout for LED Heat Dissipation

The patent extracts heat from the display device by forming holes through the substrate that extend from the interior to the exterior surface. These holes create heat dissipation channels that remove heat generated by light emitting elements, allowing the device to maintain light emission functionality while preventing overheating through active heat extraction pathways.

The patent introduces a heat dissipation structure comprising holes as an intermediary element between the heat source (light emitting elements) and the external environment. These holes act as mediators that facilitate heat transfer from the interior to the exterior, enabling thermal management without interfering with the light emission function of the display device.

The substrate serves multiple functions: it acts as both the structural support for the display device and as a component containing heat dissipation channels. The holes formed through the substrate utilize the existing substrate material and structure, allowing it to simultaneously provide mechanical support and thermal management functionality, thereby reducing overall device complexity while improving heat dissipation.

The patent creates a porous structure by forming holes through the substrate. This porous configuration provides dedicated heat dissipation pathways while maintaining the structural integrity of the substrate. The holes create channels for heat and fluid flow without requiring additional complex heat dissipation components, achieving efficient thermal management through a relatively simple structural modification.