Display Through-Hole Etch Stopper Layout for Corrosion-Free Wiring

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Solution Overview

Problem

Current display devices face challenges in optimizing the placement of driving circuits, leading to inefficiencies in space utilization and potential corrosion from etching solutions, which affects the performance and reliability of the display.

Innovation Solution

The solution involves disposing driving circuits on the back surface of a base substrate, utilizing an etching stopper with a through-hole and a substrate connection electrode to reduce dead space and prevent etching solution diffusion, while employing laser irradiation and wet etching to form high-aspect-ratio substrate through-holes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If driving circuits are disposed on the front surface of the base substrate, then electrical connection is achieved, but dead space increases and etching solution corrosion occurs

Engineering Contradiction:

Improvecorrosion resistanceVSAvoiddead space

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent moves the driving circuits from the front surface (2D plane) to the back surface of the base substrate, utilizing the third dimension (thickness direction) to resolve the conflict between dead space and corrosion resistance. This dimensional transition allows electrical connection through substrate through-holes while eliminating the harmful exposure to etching solutions on the front surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The substrate connection electrode acts as an intermediary element, bridging the driving circuits on the back surface with the front surface through the substrate through-holes. This mediator enables electrical connection without requiring the driving circuits to be exposed on the front surface, thus preventing corrosion while maintaining functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If substrate through-holes are formed with conventional methods, then connection is achieved, but aspect ratio and processing quality are insufficient

Engineering Contradiction:

Improveaspect ratio of substrate through-holesVSAvoidprocessing difficulty

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces conventional mechanical drilling or etching methods with laser irradiation to form substrate through-holes. This substitution enables precise control over hole geometry, achieving high aspect ratios and superior processing quality that are difficult to obtain with traditional mechanical approaches.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes laser parameters (wavelength, pulse duration, power) to precisely control the formation of substrate through-holes. By adjusting these parameters, the process achieves high aspect ratios and excellent processing quality, transforming the manufacturing capability through parameter optimization rather than mechanical means.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces dead space and prevents corrosion, enhancing processing quality, speed, and the aspect ratio of substrate through-holes, thereby improving the overall performance and reliability of the display device.

Implementation Method 1

employing laser irradiation and wet etching to form high-aspect-ratio substrate through-holes

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

employing laser irradiation and wet etching to form high-aspect-ratio substrate through-holes

Methodology Applied

Scientific EffectWet etching:

Implementation Method 3

utilizing an etching stopper with a through-hole and a substrate connection electrode to reduce dead space and prevent etching solution diffusion

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS11756967B2Display device having etch stoppers with through holes

Publication Date: 2023.09.12 SAMSUNG DISPLAY CO LTD

AI summary

A display device includes a first substrate having a display area and a non-display area adjacent to the display area, the first substrate including a substrate through-hole penetrating the first substrate in a thickness direction, an etching stopper disposed on a first surface of the first substrate, the etching stopper including a stopper through-hole that overlaps the substrate through-hole and penetrates the etching stopper in the thickness direction, a data line disposed on the etching stopper, a substrate connection electrode that fills the substrate through-hole and the stopper through-hole, the substrate connection electrode being disposed in the display area and electrically connected to the data line, and a first pad disposed on a second surface of the first substrate opposite to the first surface and overlapping the substrate connection electrode. The first pad is electrically connected to the substrate connection electrode.