Display Panel Through-Hole Layout for Reduced Non-Display Area
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Solution Overview
Problem
Conventional display panels with driving chips located on the same layer as light emitting elements suffer from degraded display quality due to the presence of non-display areas, which compromise the overall visual performance.
Innovation Solution
A display panel design featuring a substrate with a through hole containing a conductive part and a resin part, where the circuit layer and pads are electrically connected through the conductive part, allowing them to be positioned on different layers, thereby eliminating the non-display area and enhancing display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the driving chip and light emitting elements are disposed on the same layer, then the manufacturing process is simplified, but the non-display area increases and display quality degrades
Solution Approach 1:
The patent moves the driving chip from the same layer as light emitting elements to a different layer (lower layer), utilizing vertical stacking instead of planar arrangement. This dimensional transition allows both components to coexist without occupying the same footprint area, thereby reducing non-display area while maintaining manufacturing feasibility through sequential processing steps.
2Device complexity
If the driving chip is located at the same layer as light emitting elements, then device structure is simplified, but display quality is degraded due to non-display area
Solution Approach 1:
By transitioning from a two-dimensional planar layout to a three-dimensional stacked architecture, the patent positions the driving chip in a lower layer beneath the light emitting elements. This spatial reconfiguration eliminates the need for lateral separation zones, maximizing the display area and improving display quality while managing structural complexity through layered organization.
3Ease of manufacture
If through hole width is uniform throughout, then manufacturing process is simpler, but electrical connection reliability is insufficient
Solution Approach 1:
The patent implements an asymmetric through hole geometry where the width varies along the vertical axis - narrower at the top and wider at the bottom. This asymmetric design provides better electrical connection reliability by ensuring adequate conductive material deposition and contact area at the pad interface, while the controlled variation in width can be achieved through standard photolithography and etching processes with appropriate mask design.
Data Source
AI summary
A display panel including: a substrate having a through hole, a conductive part disposed on an inner surface of the through hole and a resin part in the through hole and adjacent to the conductive part; a circuit layer disposed at a first side of the substrate; and a pad disposed at a second side of the substrate and electrically connected to the circuit layer by the conductive part, wherein a width of the through hole is larger near the first side or the second side of the substrate than at a center of the through hole.