Display Structure With Through-Via Layout for Higher Light Extraction
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Solution Overview
Problem
The manufacturing of display devices faces challenges in achieving high light extraction rates, which is essential for large-scale display devices, as current methods are inefficient in this regard.
Innovation Solution
The proposed solution involves a display device structure that includes a substrate with an active region and peripheral region, featuring interconnection conductive layers, bonding pads, passivation layers, and through vias that are strategically formed and connected to enhance light emission and extraction, along with a light emitting structure and film configuration to improve light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional manufacturing methods are used, then the manufacturing process is simple, but the light extraction rate is poor
Solution Approach 1:
The patent divides the manufacturing process into distinct stages: forming the light emitting structure in the active region, then forming the film to cover both active and peripheral regions, and finally forming through vias in the peripheral region. This segmentation allows optimization of light extraction in the active region without compromising the integrity of peripheral connections.
Solution Approach 2:
The film is formed to cover both the active region and peripheral region before forming the through vias in the peripheral region. This preliminary action ensures that the film provides proper coverage and protection before the peripheral connections are established, preventing defects and ensuring proper structural integrity.
2Illumination intensity
If light extraction rate is improved through optimized structure, then light emission efficiency increases, but manufacturing defects like mura may occur
Solution Approach 1:
The film is formed to cover the entire substrate including both active and peripheral regions before forming through vias in the peripheral region. This preliminary coverage ensures uniform film thickness and proper protection of the light emitting structure, preventing manufacturing defects such as mura while maintaining high light emission efficiency.
Solution Approach 2:
The patent applies different processing sequences to different regions: the light emitting structure is formed in the active region to optimize light extraction, while the film and through vias are configured in the peripheral region to ensure structural integrity and prevent defects. This localized quality approach allows optimization of each region for its specific function.
Data Source
AI summary
A display device includes a substrate, an interconnection conductive layer, a bonding pad, a passivation layer, first and second through vias, a light emitting structure and a film. The substrate includes active and peripheral regions. The interconnection conductive layer is disposed on the substrate and in the active region. The bonding pad is disposed on the substrate and in the peripheral region. The passivation layer is disposed on the interconnection conductive layer and the bonding pad. The first through via passes through the passivation layer and is electrically connected to the interconnection conductive layer. The light emitting structure is disposed on the first through via. The film is disposed on the light emitting structure and covers the peripheral region of the substrate. The second through via passes through the film and a portion of the passivation layer and is electrically connected to the bonding pad.