Display Panel Transfer With Groove Solvent Discharge Control

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Solution Overview

Problem

Existing display panel fabrication methods face challenges in accurately transferring light emitting diodes and preventing uneven flow and thickness changes of metal bonding solvent, leading to inefficiencies and increased defect rates.

Innovation Solution

An apparatus and method featuring a groove-type discharge passage for metal bonding solvent on a loading module, allowing precise discharge and uniform application, combined with a transfer module for accurate placement of light emitting elements, enhancing the precision and reliability of the display panel fabrication process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal bonding solvent is applied onto the large-area fabricating substrate, then bonding effectiveness is improved, but uneven flow and thickness change occur leading to manufacturing defects

Engineering Contradiction:
Improvebonding effectivenessVSAvoidsolvent flow uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The loading module is divided into multiple groove-type discharge passages that segment the metal bonding solvent flow paths. This segmentation allows controlled discharge of solvent from specific regions, preventing uneven flow accumulation and thickness variation across the substrate surface.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The groove-type discharge passages act as intermediary structures between the solvent application point and the substrate. These grooves guide and regulate solvent flow, serving as a mediator that transforms uncontrolled pouring into directed, uniform flow patterns that prevent defects.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If light emitting elements are transferred onto the substrate, then display panel fabrication is completed, but transfer accuracy is reduced without precise positioning mechanisms

Engineering Contradiction:
Improvefabrication completionVSAvoidelement placement accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The groove-type discharge passages are pre-configured on the loading module before element transfer. This preliminary arrangement of discharge paths ensures that solvent is already positioned to facilitate accurate element placement, enabling high-precision transfer without requiring complex real-time adjustment mechanisms.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If conventional solvent application method is used, then application simplicity is maintained, but solvent discharge control is poor causing defects

Engineering Contradiction:
Improveapplication simplicityVSAvoiddefect rate
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The groove-type discharge passages are integrated into the loading module structure, allowing the system to self-regulate solvent flow without requiring external control mechanisms. The grooves automatically guide and discharge solvent in a controlled manner, achieving both simplicity and reliability.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS20240120230A1Apparatus for fabricating display panel and fabricating method thereof
Publication Date: 2024.04.11 SAMSUNG DISPLAY CO LTD
  • US20240120230A1 patent drawing
  • US20240120230A1 patent drawing
  • US20240120230A1 patent drawing

AI summary

An apparatus for fabricating a display panel and a fabricating method of a display panel are provided. An apparatus for fabricating a display panel includes a loading module of a large-area fabricating substrate fabricated and separated into a plurality of display panels, a solvent application module configured to apply a metal bonding solvent onto the large-area fabricating substrate, and an element transfer module configured to transfer a plurality of light emitting elements or at least one integrated circuit onto the large-area fabricating substrate on which the metal bonding solvent is applied, and the loading module includes a groove type discharge path through which the metal bonding solvent applied by the solvent application module flows and is discharged.