Display Encapsulation Structure With Via Groove Adhesion Boost
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Solution Overview
Problem
Existing display devices face challenges in achieving strong adhesion of the thin film encapsulation layer, which affects the reliability and mechanical stability of the device.
Innovation Solution
The implementation of a recessed via groove and strategically positioned through-holes in the pixel-defining film and protrusion, allowing for increased contact area and adhesion of the encapsulation layer, which includes a first and second encapsulation film disposed along the inner walls and bottom surface of the via groove.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional flat encapsulation layer structure is used, then the device structure is simple, but the adhesion of the encapsulation layer is insufficient
Solution Approach 1:
The encapsulation layer is designed with a curved surface that follows the contour of the pixel-defining film, transitioning from a flat structure to a curved one. This curvature increases the contact area between the encapsulation layer and the underlying structures, thereby improving adhesion and reliability without significantly complicating the manufacturing process
Solution Approach 2:
The invention extends the encapsulation layer into the vertical dimension by having it wrap around the sides of the pixel-defining film and via structures. This three-dimensional configuration increases the adhesion area from a two-dimensional planar contact to a multi-dimensional surface contact, enhancing reliability
2Reliability
If the encapsulation layer contact area is increased, then adhesion is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The pixel-defining film and the encapsulation layer are designed to work together as an integrated structure, where the pixel-defining film's contour directly defines the encapsulation layer's shape. This merging of functions allows the encapsulation layer to automatically achieve increased contact area through the existing pixel-defining film geometry, without requiring separate complex manufacturing steps
Solution Approach 2:
The pixel-defining film is formed first with its specific contour and via hole structures, which then serve as a pre-prepared template for the encapsulation layer. This preliminary action creates the adhesive surface geometry in advance, allowing the encapsulation layer to conform to it naturally during subsequent deposition, simplifying the overall manufacturing process
Data Source
AI summary
A display device includes a via layer disposed on a substrate and including a via groove having a shape recessed from a first surface to a second surface of the via layer. A first electrode is disposed on the first surface. A pixel-defining film is disposed on the via layer and the first electrode. A first pixel-defining film through-hole passes through the pixel-defining film in a thickness direction and exposes the first electrode. A second pixel-defining film through-hole passes through the pixel-defining film in the thickness direction. The second pixel-defining film through-hole is spaced apart from the first pixel-defining film through-hole and overlaps the via groove. An emission layer is disposed on an exposed portion of the first electrode. A protrusion is disposed on the pixel-defining film and includes a protrusion through-hole which passes through the protrusion in the thickness direction and overlaps the second pixel-defining film through-hole.