Display Via Structure for Higher Light Extraction and Pad Access
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing of display devices faces challenges in achieving high light extraction rates, which is crucial for large-scale display devices, as existing methods are inefficient in this regard.
Innovation Solution
The proposed solution involves a display device structure that includes a substrate with an active region and a peripheral region, featuring interconnection conductive layers, bonding pads, passivation layers, and through vias that facilitate the formation of a light emitting structure and a film, allowing for improved electrical connections and light extraction through specific manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional manufacturing methods are used, then the manufacturing process is simple, but the light extraction rate is poor
Solution Approach 1:
The manufacturing process is divided into multiple sequential steps: forming the passivation layer, creating the first through via, depositing the light emitting structure, forming the film, and creating the second through via. This segmentation allows each step to be optimized independently for light extraction while maintaining overall process manageability
Solution Approach 2:
The passivation layer is formed first to protect the substrate before any via formation. The first through via is created before depositing the light emitting structure, ensuring proper electrical connection pathways are established in advance. These preliminary actions prevent defects and ensure optimal light extraction performance
2Illumination intensity
If the light emitting structure is formed early, then light extraction can be optimized, but electrical connections to bonding pads become more difficult
Solution Approach 1:
The solution introduces a vertical stacking arrangement where the light emitting structure is positioned above the first through via, which connects to the interconnection conductive layer. The second through via then provides a vertical pathway from the film through the passivation layer to the bonding pad. This dimensional arrangement allows both optimized light extraction and electrical connectivity to bonding pads without conflict
Data Source
Figure 1A
Figure 1B
Figure 2A
AI summary
A display device includes a substrate, an interconnection conductive layer, a bonding pad, a passivation layer, first and second through vias, a light emitting structure and a film. The substrate includes active and peripheral regions. The interconnection conductive layer is disposed on the substrate and in the active region. The bonding pad is disposed on the substrate and in the peripheral region. The passivation layer is disposed on the interconnection conductive layer and the bonding pad. The first through via passes through the passivation layer and is electrically connected to the interconnection conductive layer. The light emitting structure is disposed on the first through via. The film is disposed on the light emitting structure and covers the peripheral region of the substrate. The second through via passes through the film and a portion of the passivation layer and is electrically connected to the bonding pad.