Display Wiring Substrate Layout for Non-Overlapping Pad Connections
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Solution Overview
Problem
Existing semiconductor products face challenges in reliable electrical connections due to overlapping circuits in different layers, leading to potential short circuits and transmission delays.
Innovation Solution
A wiring substrate design featuring a base substrate with control areas that include drive circuit pad groups, functional element pad groups, signal lines, and connection lines, where the first connection lines are configured to cascade adjacent drive circuit pad groups without overlapping with signal lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If connection lines are routed in overlapping paths with signal lines to simplify wiring, then device complexity is reduced, but reliability deteriorates due to potential short circuits
Solution Approach 1:
The patent utilizes multi-layer wiring structure where connection lines and signal lines are routed in different layers (first wiring layer and second wiring layer). This dimensional separation allows both lines to coexist without overlapping in the same plane, eliminating short circuit risks while maintaining wiring simplicity. The via holes connect different layers to establish vertical electrical connections.
Solution Approach 2:
The wiring structure is segmented into multiple independent layers, with each layer carrying specific signal or connection lines. This segmentation isolates potential interference paths and allows independent routing optimization for each layer, reducing overall wiring complexity while ensuring reliability through layer separation.
2Loss of time
If connection lines are routed directly between adjacent drive circuit pad groups, then transmission delay is reduced, but the risk of short circuits with signal lines increases
Solution Approach 1:
Direct connections between adjacent drive circuit pad groups are achieved by routing connection lines in a different layer than signal lines. This vertical separation via via holes enables short and direct transmission paths without horizontal overlap with signal lines, simultaneously reducing transmission delay and preventing short circuits.
3Reliability
If multiple wiring layers are used to separate connection lines and signal lines, then reliability is improved, but device complexity increases
Solution Approach 1:
Each wiring layer is designed to serve multiple functions: carrying specific signals, providing electrical connections, and acting as an isolation plane for other layers. The via holes serve dual purposes of vertical connection and layer transition. This multi-functionality reduces the need for additional dedicated structures, offsetting the complexity of the multi-layer approach.
Data Source
AI summary
A wiring substrate includes: a base substrate; and a plurality of control areas on one side of the base substrate, each of the plurality of control areas extending in a first direction, the plurality of control areas being sequentially arranged in a second direction, and any one of the plurality of control areas including: a plurality of drive circuit pad groups sequentially arranged in the first direction; a plurality of functional element pad groups, each of which being electrically connected with the corresponding drive circuit pad group; a plurality of signal lines, main bodies of which extend in the first direction; and first connection lines, each of which is configured to cascade two drive circuit pad groups adjacent in the first direction, orthographic projections of the first connection lines on the base substrate not overlapping with orthographic projections of the signal lines on the base substrate.