Conformal Dissipative Coatings for Semiconductor Robot End Effectors
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Solution Overview
Problem
In electronic device manufacturing, the rapid movement of robots transporting substrates generates charged particles that can lead to substrate defects due to electrostatic charges accumulating on surfaces, causing issues like arcing and substrate damage.
Innovation Solution
Applying a uniform, conformal, and porosity-free electrically-dissipative coating on robot arm end effectors and chamber components using atomic layer deposition (ALD), chemical vapor deposition (CVD), plasma enhanced atomic layer deposition (PEALD), or metal organic chemical vapor deposition (MOCVD) processes to provide a dissipative path for charges, preventing particle accumulation and reducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick coating is applied to provide adequate electrostatic dissipation, then the dissipative path effectiveness is improved, but the coating complexity and deposition time increase
Solution Approach 1:
The patent changes the electrical resistance parameter of the coating material to achieve electrostatic dissipation with much thinner layers (1-10 micrometers) compared to traditional insulating coatings. This parameter change allows adequate dissipation effectiveness while reducing coating thickness and complexity
Solution Approach 2:
The patent uses composite materials combining insulating ceramic particles (alumina, silica) with conductive binders (graphite, metal powders) to create coatings with tailored electrical properties. This composite approach enables electrostatic dissipation in thin coatings without requiring thick layers, resolving the contradiction between dissipation effectiveness and coating complexity
2Reliability
If a thick coating is applied to ensure electrostatic dissipation, then the charge dissipation capability is improved, but the manufacturing precision and substrate feature access deteriorate
Solution Approach 1:
Changing the electrical resistance parameter enables achieving adequate charge dissipation with thin coatings (1-10 micrometers) rather than thick coatings, thereby maintaining access to substrate features while providing electrostatic protection
Solution Approach 2:
The patent applies electrostatic dissipation coating selectively only in areas where charge accumulation is problematic, rather than coating entire surfaces thickly. This localized approach maintains manufacturing precision and substrate feature access while providing adequate charge dissipation capability
3Stability of the object's composition
If multiple coating layers are applied to achieve uniform coverage, then the coating uniformity is improved, but the deposition time and process complexity increase
Solution Approach 1:
The patent incorporates electrostatic dissipation additives (graphite, metal powders) into the coating formulation before application, allowing single-layer deposition that achieves both uniform coverage and electrostatic dissipation functionality simultaneously, eliminating the need for multiple sequential coating steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrically-dissipative coatings effectively dissipate electrostatic charges, reducing substrate defects, improving particle performance, and maintaining coating integrity under extreme conditions like vacuum and thermal shock, while being cost-effective and uniformly applied across complex surfaces.
Implementation Method 1
The electrically-dissipative material may provide a dissipative path from the coating to the ground
Implementation Method 2
depositing a coating onto a surface of a chamber component using an atomic layer deposition (ALD) process
Implementation Method 3
depositing a coating onto a surface of a chamber component using an atomic layer deposition (ALD) process, a chemical vapor deposition (CVD) process
Implementation Method 4
a plasma enhanced atomic layer deposition (PEALD) process
Data Source
AI summary
Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.