Distributed Impingement Cold Plate Manifold for Corrosion-Resistant Cooling
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Solution Overview
Problem
Conventional liquid cooling systems for high-power microprocessors face limitations due to low fin efficiency and susceptibility to corrosion and clogging, especially when using facility-grade cooling liquids, necessitating multiple cooling loops and specialized water quality control.
Innovation Solution
A multi-layer manifold design with distributed and localized jet impingement pairs, combined with a protective coating, allows for efficient heat transfer and resistance to facility-grade liquids, eliminating the need for separate cooling loops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional microchannels are used for liquid cooling, then heat transfer coefficient is high, but fin efficiency is diminished and fin height is limited to less than 4 mm
Solution Approach 1:
The patent transitions from conventional two-dimensional microchannel cooling to three-dimensional jet impingement cooling. Multiple jet nozzles are positioned at different heights and angles to impinge cooling liquid onto the fin surfaces from multiple directions, creating volumetric cooling rather than surface-level cooling only. This dimensional change allows effective cooling of taller fin structures that would be inaccessible to conventional planar microchannel flows.
Solution Approach 2:
The cooling system is segmented into multiple independent jet nozzle units distributed across the cold plate surface. Each nozzle independently targets specific fin regions, allowing the system to cool extensive fin arrays by dividing the cooling task into multiple localized impingement zones. This segmentation enables scaling to taller and larger fin structures.
2Ease of manufacture
If facility-grade cooling liquids are used, then operational costs are reduced, but corrosion and clogging susceptibility increases
Solution Approach 1:
The patent employs composite material strategies in two key areas: (1) The cold plate and manifold structures use corrosion-resistant material combinations such as stainless steel or aluminum alloys with protective coatings; (2) The jet nozzle openings are designed with specific geometric configurations and protective features that resist clogging from particulates in facility-grade liquids. This composite approach enables the use of cost-effective facility-grade cooling liquids while maintaining system reliability.
Solution Approach 2:
The patent modifies flow parameters including jet velocity, impingement angle, and flow rate to optimize cooling performance while minimizing the harmful effects of facility-grade liquids. By controlling these parameters, the system achieves effective cooling without exacerbating corrosion or clogging issues, enabling reliable operation with lower-cost cooling liquids.
3Reliability
If multiple cooling loops are implemented to prevent corrosion and clogging, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent designs a single cooling loop manifold system that performs multiple functions: distributing cooling liquid to multiple jet nozzles, collecting spent liquid from multiple fin regions, and incorporating corrosion resistance and clogging prevention features throughout. This multi-functional single-loop design eliminates the need for separate cooling loops while maintaining reliability through integrated protection mechanisms.
Solution Approach 2:
The patent merges the functions of multiple cooling loops into a single integrated manifold system. The manifold combines distribution channels to multiple nozzles, collection channels from multiple regions, and protection features into one unified structure, reducing system complexity while maintaining the reliability needed to handle facility-grade cooling liquids.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat transfer efficiency and resistance to corrosion, enabling reliable cooling using facility-grade liquids in a single loop, thus reducing operational complexity and costs.
Implementation Method 1
Cold plates are a type of heatsink that allows for a cooling liquid to be brought into thermal conduction contact with the heat generating electronic components
Implementation Method 2
These cold plates rely upon ultra-narrow fluid passages called microchannels to dissipate heat from the processors into the cooling liquid
Implementation Method 3
A multi-layer manifold design with distributed and localized jet impingement pairs, combined with a protective coating, allows for efficient heat transfer and resistance to facility-grade liquids
Data Source
AI summary
A cold plate assembly includes a cold plate having first surface attachable to heat generating electronic component(s) and opposite second surface enclosed by an encapsulating lid that has inlet and exhaust ports. A distributed impingement and recovery manifold (DIRM) is positioned above the second surface of the cold plate. The DIRM includes an intake manifold presenting at least one sequence of nozzle openings providing direct impingement of cooling liquid on corresponding sections of the second surface and a return manifold which facilitates a return of exhaust cooling liquid to the exhaust port following at least one direct impingement of the portion of cooling liquid onto the corresponding sections to provide distributed, localized impingement cooling at corresponding sections of the cold plate.