Cooling/Ventilation/Heating Modifications TRIZ Cases

Thermosyphon loops passively cool multiple electronic devices while sensors monitor vapor quality, heat load, and liquid level.

An insoluble-fluid sequence displaces gas and two-phase coolant in heat transfer loops, reducing leakage and fire risk.

Distinct cooling zones tailor flow and heat transfer to each die, avoiding wasted capacity across multidie packages.

A flow-guiding trough and enclosing barrier contain leaks from server cooling joints and pipelines, reducing escape risk.

Multiple absorber/generator stages use server waste heat to cool data centers without additional heaters, improving efficiency.

Spring-loaded plates and an elastic layer accommodate manifold variations while improving blind-mating alignment and leak prevention.

A perforated plate and overflow gap guide dielectric liquid through natural convection, improving temperature control with fewer pumps and components.

Series-connected MHACUs redirect cooling fluid by temperature thresholds, balancing rack cooling and energy use in closed data centers.

A ducted heat path cools camera substrates while reducing pan-base weight and preserving high rotational acceleration.

Separate water-cooling rails cool high-power components while maintaining a stable reference temperature for sensitive RF components.

Liquid conduits, cold plates, and a thermo-osmotic membrane regulate server module temperatures in high-density GPU racks.

A sensor-driven controller adjusts pump flow, fan speed, and dry cooler operation to widen temperature control and conserve water.

This case shows how a self-supporting computing manifold uses an overhead secondary manifold and containment tray to manage leaks.

A closed-loop cold plate, radiator, fans, and pressure sensing cool high-power electronics across varied server configurations.

A baffle-guided flow divider uses density differences to isolate cooling water and protect working-fluid purity in immersion cooling.

This case uses selectable upper and lower mounting locations to route one liquid-cooling manifold across varied rack configurations.

Thermal barriers and adjustable louvers separate heat zones and guide cabinet airflow.

Closed-loop microchannels and micromixers improve heat exchange in high-flux ICs.

Coldplates, conduits, and manifolds replace air cooling to manage heat in high-density pluggable network modules.

A layered intake and return manifold delivers localized jets and protective coating support single-loop cooling with facility-grade liquids.

Fixed rack manifolds struggle with changing server sizes; a 180-degree rotation switches hole patterns to maintain cooling compatibility.

Separate cooling branches deliver higher coolant flow to key components while lowering waste in immersed computing systems.

This case routes heated air from UPS modules and battery racks outside, reducing mechanical cooling energy and installation costs.

A liquid cooling row and adapter assembly precool returned refrigerant before it re-enters the CDU, improving cooling efficiency.

A frame and planar cover contain hose-fitting leaks while a sensor detects cooling fluid near electronics.