Integrated Heat Sink Microchannels for High-Flux IC Cooling
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Solution Overview
Problem
Existing IC thermal management techniques, particularly those using embedded microchannels, suffer from high flow resistance and limited thermal exchange efficiency, which is inadequate for advanced IC devices with high heat fluxes and localized hot spots, degrading performance and reliability.
Innovation Solution
An integrated heat sink structure with a plurality of closed-loop microchannels coupled to a hybrid active-passive micromixer chamber, controlled by an active oscillate input phase (OIP) system, enhances thermal exchange efficiency by managing the flow of liquids through multiple inlets and outlets, optimizing temperature and velocity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If embedded microchannels are used for IC cooling, then cooling capability is provided, but flow resistance increases and thermal exchange efficiency is limited
Solution Approach 1:
The microchannel structure is divided into multiple segments including straight channels, curved channels, and micromixer chambers arranged in series. This segmentation creates multiple flow paths and mixing zones that enhance thermal exchange efficiency while distributing the flow resistance across different functional zones rather than concentrating it in a single long channel.
Solution Approach 2:
The microchannel structure incorporates periodic features including alternating straight and curved channels, and multiple micromixer chambers spaced along the flow path. This periodic arrangement creates repeated flow direction changes and mixing events that continuously refresh the thermal boundary layer, improving heat transfer efficiency without requiring excessive flow rate.
2Productivity
If IC device density is increased to improve performance, then device capability improves, but heat flux and thermal management challenge increase
Solution Approach 1:
The cooling structure transitions from planar microchannels to a three-dimensional configuration with vertical micromixer chambers and multi-level channel arrangements. This dimensional expansion increases the effective heat transfer surface area and creates additional thermal exchange pathways, enabling the system to handle higher heat fluxes generated by dense IC devices.
Solution Approach 2:
The microchannel structure combines different channel geometries (straight and curved) with micromixer chambers to create a composite cooling system. This composite design integrates multiple heat transfer mechanisms including forced convection in channels and enhanced mixing in chambers, providing superior thermal management capability for high-density IC devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated heat sink structure effectively increases thermal exchange efficiency, addressing the IC thermal management challenge by improving cooling capabilities for advanced IC circuits and devices.
Implementation Method 1
heat transfer away from the IC die through the TIM layer and through the microchannel walls to the liquid
Implementation Method 2
The liquid is injected into a micromixer chamber... enhancing the thermal exchange efficiency
Data Source
AI summary
One aspect of the present disclosure pertains to an integrated circuit (IC) structure. The IC structure includes a die and an integrated heat sink structure disposed over the die. In some embodiments, the integrated heat sink structure includes a first closed-loop microchannel structure adjacent to the die and a second closed-loop microchannel structure disposed over the first closed-loop microchannel structure. In an example, the second closed-loop microchannel structure is disposed further away from the die that the first closed-loop microchannel structure. In some implementations, a plurality of microchannels and a micromixer chamber collectively provide the first and second closed-loop microchannel structures.