Liquid-Cooled Pluggable Modules for High-Density Network Elements
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Solution Overview
Problem
The increasing heat dissipation and power density in high-density network pluggable modules, particularly pluggable optics, pose significant thermal management challenges due to the need for maintaining temperatures below 70°C for reliable data transmission, especially with advancements in port density from 24xQSFP28 to 36xQSFP-DD, which current air cooling technologies struggle to address.
Innovation Solution
Implementing liquid cooling systems with integrated or riding coldplates that eliminate dry contact interfaces, utilizing manifolds and conduits for efficient cooling of pluggable modules, including integrated liquid-cooled sled modules that provide additional functionality beyond optical interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling technologies are used for high-density network pluggable modules, then the cooling system is simple to implement, but the heat dissipation capability is insufficient to maintain temperatures below 70°C
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by implementing cold plates with coolant flow channels that directly contact the pluggable module housings. The coolant (liquid) absorbs heat more efficiently than air, enabling the system to maintain operating temperatures below 70°C even with high power density modules. The liquid cooling system includes pumps, manifolds, and distribution networks to deliver coolant to multiple modules simultaneously.
Solution Approach 2:
The patent replaces the mechanical air cooling system (fans, heat sinks) with a liquid-based thermal management system. This substitution enables superior heat transfer efficiency through direct liquid-to-module contact via cold plates, eliminating the limitations of convective air cooling and enabling effective heat removal from high-density configurations.
2Productivity
If port density is increased from 24xQSFP28 to 36xQSFP-DD, then the data transfer capacity is improved, but the heat dissipation challenge is intensified
Solution Approach 1:
The patent merges multiple cooling functions into an integrated liquid cooling system that serves multiple high-density pluggable modules simultaneously. The system combines cold plates, coolant distribution manifolds, and thermal coupling mechanisms to provide unified thermal management for 36xQSFP-DD modules, enabling the high port density configuration to operate within temperature limits.
Solution Approach 2:
The patent uses liquid coolant flowing through channels in cold plates to remove heat from densely packed pluggable modules. The hydraulic system delivers coolant under pressure to multiple modules, providing scalable heat dissipation that matches the increased power density of the 36xQSFP-DD configuration.
3Temperature
If liquid cooling systems with integrated coldplates are implemented, then the operating temperature is reduced, but the device complexity is increased
Solution Approach 1:
The patent designs universal cold plate assemblies that can interface with multiple types of pluggable modules (QSFP28, QSFP-DD, etc.) through standardized mounting mechanisms. The liquid cooling system serves multiple functions: cooling electronic components, maintaining temperature below 70°C, and enabling high port density configurations. The modular design allows the same cooling infrastructure to support different module types.
Solution Approach 2:
The patent implements nested cooling structures where cold plates are integrated within or alongside the pluggable module housings. The coolant channels are embedded within the cold plate structure, which itself is coupled to the module heat-generating components. This nested arrangement maximizes thermal contact while minimizing the overall system footprint and structural complexity.
4Temperature
If dry contact interfaces are eliminated in favor of liquid cooling, then the thermal contact is improved, but the manufacturing complexity is increased
Solution Approach 1:
The patent replaces dry air-contact interfaces with liquid coolant flowing through sealed channels in cold plates. The liquid provides continuous thermal contact with the module housings, eliminating the intermittent contact problems of air cooling. The manufacturing complexity is managed through standardized cold plate designs with integrated coolant channels that can be mass-produced using precision machining or additive manufacturing techniques.
Solution Approach 2:
The patent substitutes the mechanical air cooling system with a liquid-based thermal management system. This replacement improves thermal contact efficiency by eliminating air gaps and providing direct liquid-to-module heat transfer. The manufacturing complexity is addressed through modular cold plate assemblies that can be pre-assembled and tested before integration into the overall cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid cooling systems effectively reduce operating temperatures, minimize space requirements for cooling, and enable higher power delivery to pluggable modules, allowing for increased port density and compact architectures, surpassing the limitations of conventional air cooling.
Implementation Method 1
a cooling fluid that flows through the conduit to cool the one or more pluggable modules
Implementation Method 2
cooling fluid that flows through the conduit to cool the one or more pluggable modules
Data Source
AI summary
A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.