Standalone Computing Manifold Assembly for Overhead Leak Containment

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Solution Overview

Problem

Conventional liquid cooling systems for computing devices in hyperscaler environments, which lack raised floors, face challenges in maintaining structural stability, reliability, and safety without relying on data center infrastructure, and require innovative designs to manage fluid distribution and leak containment.

Innovation Solution

A standalone manifold system with a secondary manifold positioned above the racks, supported by a containment tray and leak detection components, which includes a self-supporting structure and integrated leak containment features to manage fluid distribution and leaks independently of data center structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional liquid cooling systems are deployed in hyperscaler environments without raised floors, then deployment flexibility is improved, but structural stability and reliability deteriorate

Engineering Contradiction:
Improvedeployment flexibilityVSAvoidstructural stability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The manifold system is divided into modular components including a manifold assembly, containment tray, and support structure that can be independently installed and configured. This segmentation allows the system to adapt to different deployment environments while maintaining structural integrity through standardized connection interfaces.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A support structure serves as an intermediary element between the manifold assembly and the floor, providing structural stability without requiring raised floor infrastructure. The support structure acts as a mediator that enables the system to function in conventional data center environments while maintaining reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If fluid distribution systems are positioned close to computing devices, then cooling efficiency is improved, but leak containment difficulty worsens

Engineering Contradiction:
Improvecooling efficiencyVSAvoidleak containment complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The containment tray is nested within or integrated with the manifold assembly structure, creating a nested configuration where the fluid distribution system is positioned close to computing devices for efficient cooling, while the containment tray provides leak containment functionality without significantly increasing overall system complexity.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Adaptability or versatility

If standalone manifold systems are implemented, then independence from data center infrastructure is improved, but manufacturing and installation complexity worsens

Engineering Contradiction:
Improveindependence from infrastructureVSAvoidmanufacturing complexity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The manifold assembly is designed as a universal component that performs multiple functions: fluid distribution, structural support, and leak containment. This multi-functionality reduces the need for separate components and simplifies manufacturing while enabling independent deployment without relying on specialized data center infrastructure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250234483A1Manifold system for computing assembly
Publication Date: 2025.07.17 AMD DESIGN LLC
  • US20250234483A1 patent drawing
  • US20250234483A1 patent drawing
  • US20250234483A1 patent drawing

AI summary

A manifold system is provided. A secondary manifold is operable to be fluidly coupled with a liquid cooling system for each of a plurality of computing devices. The secondary manifold is configured to be positioned above the plurality of computing devices. A containment tray is disposed between the secondary manifold and the computing devices. The containment tray is operable to receive fluid that leaks from the secondary manifold.