Distributed LDO Layout for SoC Thermal Hot Spot Control
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Solution Overview
Problem
Integrated voltage regulators in processors often create localized hot spots due to inductance locality issues, limiting performance gains and potentially exacerbating thermal problems, especially when concentrated in one location on the die.
Innovation Solution
The implementation of dynamically controllable low dropout regulators (LDOs) that can be enabled or disabled based on thermal information, allowing for distributed power delivery and fine-grained control to reduce heat dissipation and improve peak performance by selectively powering or disabling regulators near hot spots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If integrated voltage regulators are concentrated in one location on the die, then inductance locality issues are addressed and power regulation is simplified, but localized hot spots are created and thermal problems are exacerbated
Solution Approach 1:
The patent divides the integrated voltage regulator into multiple segmented units distributed across different locations on the die. Each regulator unit can be independently controlled to provide power to nearby processing elements, eliminating the need for a single concentrated regulator and thereby preventing localized hot spots while maintaining simplified power regulation architecture.
Solution Approach 2:
The patent implements regulators with different operational characteristics at different locations on the die. Each regulator unit is optimized for its specific location and can be independently enabled or disabled based on thermal conditions, allowing local adaptation to thermal constraints while maintaining overall system efficiency.
2Use of energy by moving object
If voltage reduction is implemented at the transistor level, then active power savings are achieved through squared voltage reduction, but regulator efficiency decreases and thermal management becomes more challenging
Solution Approach 1:
The patent implements dynamic control of regulator units based on real-time thermal feedback from sensors. The system can dynamically enable or disable specific regulator units depending on thermal conditions, allowing the processor to optimize the trade-off between power savings from voltage reduction and regulator efficiency losses under varying operational conditions.
Solution Approach 2:
The patent incorporates thermal sensors that provide feedback to the power management system. This feedback mechanism allows the system to monitor thermal conditions and adjust regulator operation accordingly, preventing excessive heat generation while maintaining power efficiency through informed dynamic regulation decisions.
3Temperature
If distributed regulator units are implemented across the die, then thermal hot spots are reduced and performance is improved, but device complexity and control mechanisms increase
Solution Approach 1:
The patent implements a self-managing power distribution system where each regulator unit can be independently controlled based on local thermal conditions. The system uses thermal sensors and power management logic that automatically adjust regulator operation without requiring complex external control, allowing distributed regulation to achieve thermal management goals while keeping control complexity manageable through autonomous local decision-making.
Data Source
AI summary
In one embodiment, a processor includes: a first plurality of intellectual property (IP) circuits to execute operations; and a second plurality of integrated voltage regulators, where the second plurality of integrated voltage regulators are oversubscribed with respect to the first plurality of IP circuits. Other embodiments are described and claimed.