Distributed Multi-Zone Plasma Source for Uniform Etching
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Solution Overview
Problem
Plasma reaction chambers suffer from center-to-edge non-uniformities in neutral species distribution, leading to inconsistent plasma processing results, particularly in small volume product chambers with large aspect ratios, which affects processes like dielectric etch and other neutral-dependent applications.
Innovation Solution
A distributed multi-zone plasma source system with multiple ring plasma sources, each equipped with a primary winding and ferrites, arranged in arrays around the process chamber, which generates a concentrated magnetic field to induce a secondary current and plasma, allowing for more uniform gas distribution and processing across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a single plasma source is used in a small volume product chamber, then the chamber can maintain a compact size, but center-to-edge uniformity of neutral species distribution deteriorates
Solution Approach 1:
The single plasma source is divided into multiple plasma sources (e.g., three sources labeled 30a, 30b, 30c) that are spatially distributed across the chamber top. Each source independently generates plasma that overlaps to create a uniform combined plasma field across the substrate, resolving the uniformity issue while maintaining compact chamber volume.
Solution Approach 2:
The patent transitions from a single-point plasma source to a distributed array of plasma sources arranged in specific geometric patterns (triangular, rectangular, or circular configurations). This spatial arrangement in multiple dimensions enables uniform plasma distribution across the substrate surface while keeping the chamber compact.
2Manufacturing precision
If multiple plasma sources are distributed across the chamber top, then center-to-edge uniformity of plasma processing is improved, but device complexity increases
Solution Approach 1:
Multiple plasma sources are merged into a coordinated system where their plasma fields overlap and combine to create a uniform plasma distribution. The sources share common support structures, gas delivery systems, and control mechanisms, reducing the overall system complexity despite having multiple sources.
Solution Approach 2:
The distributed plasma sources are designed with identical or similar structures that can be replicated, allowing each source to perform the same function. This modular universality simplifies design, manufacturing, and maintenance while achieving the desired uniformity through their collective operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances center-to-edge uniformity of plasma processing, reducing variations in radical and neutral species concentrations, thereby improving the consistency and efficiency of processes like etching across the substrate.
Implementation Method 1
A primary current is applied to a primary winding around an exterior of the plasma chamber and generates a magnetic field
Implementation Method 2
A distributed multi-zone plasma source system with multiple ring plasma sources, each equipped with a primary winding and ferrites, arranged in arrays around the process chamber, which generates a concentrated magnetic field
Implementation Method 3
enhances center-to-edge uniformity of plasma processing, reducing variations in radical and neutral species concentrations
Data Source
AI summary
A processing chamber including multiple plasma sources in a process chamber top. Each one of the plasma sources is a ring plasma source including a primary winding and multiple ferrites. A plasma processing system is also described. A method of plasma processing is also described.